Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

  • B. Shivamurthy
  • B. H. S. ThimmappaEmail author
  • Rohan Purushothama
  • G. K. V. D. Datta Sai
Regular Paper


Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.


Mechanical properties Electrical conductivity Particulate polymer films 


  1. 1.
    S. Geetha, K.K.S. Kumar, C.R.K. Rao, M. Vijayan, D.C. Trivedi, EMI shielding: methods and materials—a review. J. Appl. Polym. Sci. 112, 2073–2086 (2009)CrossRefGoogle Scholar
  2. 2.
    Y.P. Mamunya, V.V. Davydenko, P. Pissis, E.V. Lebedev, Electrical and thermal conductivity of polymers filled with metal powders. Eur. Polym. J. 38, 1887–1897 (2002)CrossRefGoogle Scholar
  3. 3.
    E. Sancaktar, L. Bai, Electrically conductive epoxy adhesives. Polymers 3, 427–466 (2011)CrossRefGoogle Scholar
  4. 4.
    D.S. McLachlan, M. Blaszkiewicz, R.E. Newnham, Electrical resistivity of composites. J. Am. Ceram. Soc. 73, 2187–2203 (1990)CrossRefGoogle Scholar
  5. 5.
    ASTM Standard D882-12, Standard Test Method for Tensile Properties of Thin Plastic Sheeting (ASTM International, West Conshohocken, 2012)Google Scholar
  6. 6.
    ASTM Standard D2176-16, Standard Test Method for Folding Endurance of Paper and Plastic Film by MIT Test (ASTM International, West Conshohocken, 2016)Google Scholar
  7. 7.
    ASTM Standard DF2392-04, Standard Test Method for Burst Strength of Surgical Sealants (ASTM International, West Conshohocken, 2015)Google Scholar
  8. 8.
    K. Emrah, C.Y. Ozcelik, S. Yetgin, F.O. Omurlu, D. Balkose, Preparation and characterization of flexible polyvinylchloride copper composite films. Polym. Polym. Compos. 21, 139–144 (2013)Google Scholar
  9. 9.
    K. Yaman, Ö. Taga, Thermal and electrical conductivity of unsaturated polyester resin filled with copper filler composites. Int. J. Polym. Sci. Article ID 8190190 (2018)Google Scholar

Copyright information

© The Korean Institute of Electrical and Electronic Material Engineers 2018

Authors and Affiliations

  • B. Shivamurthy
    • 1
  • B. H. S. Thimmappa
    • 2
    Email author
  • Rohan Purushothama
    • 1
  • G. K. V. D. Datta Sai
    • 1
  1. 1.Department of Mechanical and Manufacturing Engineering, Manipal Institute of TechnologyManipal Academy of Higher EducationManipalIndia
  2. 2.Department of Chemistry, Manipal Institute of TechnologyManipal Academy of Higher EducationManipalIndia

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