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Electromigration Effects During Resistance Brazing of Zn–Al/Al System

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Abstract

Liquid filler metals often experience electromigration (EM) effects during resistance brazing due to the high current density, which can affect the microstructure of the joint and reduce its strength. However, to date, few studies have investigated this effect. Here, a Zn–Al alloy filler metal was used to braze 6063 Al alloys using direct-current resistance brazing. We clearly observed that EM occurred and analyzed its effect on the microstructures and morphology of joints. Al atoms migrated from the negative side to the positive side under a combined effect of the electric field and chemical gradient, while Zn atoms migrated in the opposite direction due to a back stress gradient. Further, growth of a solid solution layer at the positive side was inhibited by the back stress gradient, which also promoted growth of a similar layer at the negative side.

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References

  1. K.N. Chiang, C.C. Lee, C.L. Chang et al., Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps. Appl. Phys. Lett. 88(7), 5451 (2006)

    Article  Google Scholar 

  2. J. Zhang, J. Yang, L. Liang et al., A molecular dynamics investigation of the micro-mechanism for vacancy formation between Ag3Sn and βSn under electromigration. Mol. Phys. 116(5), 1–8 (2018)

    Google Scholar 

  3. X. Zhao, M. Saka, M. Muraoka, M. Yamashita, H. Hokazono, Electromigration behaviors and effects of addition elements on the formation of a Bi-rich layer in Sn58Bi-based solders. J. Electron. Mater. 43(11), 4179–4185 (2014)

    Article  Google Scholar 

  4. Y. Wang, Y. Yao, A theoretical analysis of the electromigration-induced void morphological evolution under high current density. Acta Mech. Sin. (English Series) 33(5), 1–11 (2017)

    Google Scholar 

  5. M.L. Huang, J.F. Zhao, Z.J. Zhang, N. Zhao, Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn–3.0 Ag–0.5 Cu flip chip bumps undergoing electromigration. Acta Mater. 100, 98–106 (2015)

    Article  Google Scholar 

  6. Y. Yao, Y. Wang, L.M. Keer, M.E. Fine, An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. Scr. Mater. 95, 7–10 (2015)

    Article  Google Scholar 

  7. Y. Tian, J. Han, L. Ma, F. Guo, The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn–3.0 Ag–0.5 Cu solder joints. Microelectron. Reliab. 80, 7–13 (2018)

    Article  Google Scholar 

  8. F. Wang, L. Zhou, Z. Zhang, J. Wang, X. Wang, M. Wu, Effect of Sn–Ag–Cu on the improvement of electromigration behavior in Sn–58Bi solder joint. J. Electron. Mater. 46(10), 6204–6213 (2017)

    Article  Google Scholar 

  9. Y.A. Shen, C. Chen, Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration. Scr. Mater. 128, 6–9 (2017)

    Article  Google Scholar 

  10. C.E. Ho, P.T. Lee, C.N. Chen et al., Electromigration in 3D-IC scale Cu/Sn/Cu solder joints. J. Alloys Compd. 676, 361–368 (2016)

    Article  Google Scholar 

  11. M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, M.A. Fazal, Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electromigration. J. Mater. Sci. Technol. 32(11), 1129–1136 (2016)

    Article  Google Scholar 

  12. C.M. Chen, C.C. Huang, Effects of silver doping on electromigration of eutectic SnBi solder. J. Alloys Compd. 461(1–2), 235–241 (2008)

    Article  Google Scholar 

  13. L. Xu, J.H.L. Pang, Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability, in Electronic Components and Technology Conference, 2006. Proceedings, (IEEE, 2006)

  14. S. Ou, K.N. Tu, A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines, in Electronic Components and Technology Conference, 2005. Proceedings, vol. 2 (IEEE, 2005), pp. 1445–1450

  15. Y. Tanaka, T. Yamaguchi, K. Takeshita, Numerical simulation of joining during the two-step resistance brazing. Weld. Int. 27(11), 857–866 (2013)

    Article  Google Scholar 

  16. G.Q. Wei, H.L. Lin et al., Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture behavior of SAC305/Cu solder joint. China Weld. 25(03), 42–48 (2016)

    Google Scholar 

  17. H. Conrad, Influence of an electric or magnetic field on the liquid–solid transformation in materials and on the microstructure of the solid. Mater. Sci. Eng. A 287(2), 205–212 (2000)

    Article  Google Scholar 

  18. H. Gan, K.N. Tu, Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples. J. Appl. Phys. 97(6), 337–344 (2005)

    Article  Google Scholar 

  19. I.A. Blech, C. Herring, Stress generation by electromigration. Appl. Phys. Lett. 29(3), 131–133 (1976)

    Article  Google Scholar 

  20. X.F. Zhang, J.D. Guo, J.K. Shang, Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect. Scr. Mater. 57(6), 513–516 (2007)

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by National Natural Science Foundation of China (No. 51465032).

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Correspondence to Wei-yuan Yu.

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Yu, Wy., Wu, Wj., Lin, Ql. et al. Electromigration Effects During Resistance Brazing of Zn–Al/Al System. Inter Metalcast 13, 937–943 (2019). https://doi.org/10.1007/s40962-019-00313-4

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  • DOI: https://doi.org/10.1007/s40962-019-00313-4

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