Abstract
Liquid filler metals often experience electromigration (EM) effects during resistance brazing due to the high current density, which can affect the microstructure of the joint and reduce its strength. However, to date, few studies have investigated this effect. Here, a Zn–Al alloy filler metal was used to braze 6063 Al alloys using direct-current resistance brazing. We clearly observed that EM occurred and analyzed its effect on the microstructures and morphology of joints. Al atoms migrated from the negative side to the positive side under a combined effect of the electric field and chemical gradient, while Zn atoms migrated in the opposite direction due to a back stress gradient. Further, growth of a solid solution layer at the positive side was inhibited by the back stress gradient, which also promoted growth of a similar layer at the negative side.
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References
K.N. Chiang, C.C. Lee, C.L. Chang et al., Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps. Appl. Phys. Lett. 88(7), 5451 (2006)
J. Zhang, J. Yang, L. Liang et al., A molecular dynamics investigation of the micro-mechanism for vacancy formation between Ag3Sn and βSn under electromigration. Mol. Phys. 116(5), 1–8 (2018)
X. Zhao, M. Saka, M. Muraoka, M. Yamashita, H. Hokazono, Electromigration behaviors and effects of addition elements on the formation of a Bi-rich layer in Sn58Bi-based solders. J. Electron. Mater. 43(11), 4179–4185 (2014)
Y. Wang, Y. Yao, A theoretical analysis of the electromigration-induced void morphological evolution under high current density. Acta Mech. Sin. (English Series) 33(5), 1–11 (2017)
M.L. Huang, J.F. Zhao, Z.J. Zhang, N. Zhao, Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn–3.0 Ag–0.5 Cu flip chip bumps undergoing electromigration. Acta Mater. 100, 98–106 (2015)
Y. Yao, Y. Wang, L.M. Keer, M.E. Fine, An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. Scr. Mater. 95, 7–10 (2015)
Y. Tian, J. Han, L. Ma, F. Guo, The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn–3.0 Ag–0.5 Cu solder joints. Microelectron. Reliab. 80, 7–13 (2018)
F. Wang, L. Zhou, Z. Zhang, J. Wang, X. Wang, M. Wu, Effect of Sn–Ag–Cu on the improvement of electromigration behavior in Sn–58Bi solder joint. J. Electron. Mater. 46(10), 6204–6213 (2017)
Y.A. Shen, C. Chen, Effect of Sn grain orientation on the formation of Cu6S5 intermetallic compounds during electromigration. Scr. Mater. 128, 6–9 (2017)
C.E. Ho, P.T. Lee, C.N. Chen et al., Electromigration in 3D-IC scale Cu/Sn/Cu solder joints. J. Alloys Compd. 676, 361–368 (2016)
M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, M.A. Fazal, Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electromigration. J. Mater. Sci. Technol. 32(11), 1129–1136 (2016)
C.M. Chen, C.C. Huang, Effects of silver doping on electromigration of eutectic SnBi solder. J. Alloys Compd. 461(1–2), 235–241 (2008)
L. Xu, J.H.L. Pang, Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability, in Electronic Components and Technology Conference, 2006. Proceedings, (IEEE, 2006)
S. Ou, K.N. Tu, A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines, in Electronic Components and Technology Conference, 2005. Proceedings, vol. 2 (IEEE, 2005), pp. 1445–1450
Y. Tanaka, T. Yamaguchi, K. Takeshita, Numerical simulation of joining during the two-step resistance brazing. Weld. Int. 27(11), 857–866 (2013)
G.Q. Wei, H.L. Lin et al., Effect of electromigration and isothermal aging on interfacial microstructure and tensile fracture behavior of SAC305/Cu solder joint. China Weld. 25(03), 42–48 (2016)
H. Conrad, Influence of an electric or magnetic field on the liquid–solid transformation in materials and on the microstructure of the solid. Mater. Sci. Eng. A 287(2), 205–212 (2000)
H. Gan, K.N. Tu, Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples. J. Appl. Phys. 97(6), 337–344 (2005)
I.A. Blech, C. Herring, Stress generation by electromigration. Appl. Phys. Lett. 29(3), 131–133 (1976)
X.F. Zhang, J.D. Guo, J.K. Shang, Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect. Scr. Mater. 57(6), 513–516 (2007)
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This work was supported by National Natural Science Foundation of China (No. 51465032).
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Yu, Wy., Wu, Wj., Lin, Ql. et al. Electromigration Effects During Resistance Brazing of Zn–Al/Al System. Inter Metalcast 13, 937–943 (2019). https://doi.org/10.1007/s40962-019-00313-4
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DOI: https://doi.org/10.1007/s40962-019-00313-4