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Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints

  • Original Article - Theory, Characterization and Modeling
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Abstract

Solder ball of initial diameter 1.4 mm, was reflow soldered with Cu substrate at 523.15 K using flux doped with Cu@Ag core–shell nanoparticles (NPs) in the proportion 0–2 wt%. The solders were then air cooled to room temperature. The use of NPs, by reducing the base height (H) of the solder and enhanced the diameter (W) of the solder, caused an overall increase in the spread ratio of the solder. The altered magnitudes of heat and mass transfer in these geometrically different but constant volume specimens were analyzed using finite element method. The occurrence of differential concentration gradient, radial thermal gradient and velocity magnitudes, in solders with differing geometry were numerically elaborated. The \(\hbox {Cu}_{6}\hbox {Sn}_{5}\)intermetallic compound (IMC) formed at the Cu/Sn interface, was obtained to be the thickest for the specimen using undoped flux, whereas it was found to be smallest for the sample processed with flux containing 0.5% NPs. From the growth kinetics study, it has been inferred that IMC thickness is linearly proportional to the geometrical parameter H and \(\hbox {W}^b\), with b < 1.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant Nos: 51871040 and 51571049), “Research Fund for International Young Scientists” of National Natural Science Foundation of China (Grant Number: 51750110504) and China Postdoctoral Science Foundation (Grant Number: 2017M611215).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China

    Shengyan Shang, Yanfeng Wang, Jinye Yao, Yingchao Wu, Haitao Ma & Yunpeng Wang

  2. School of Mechanical Engineering, Dalian University of Technology, Dalian, 116024, China

    Anil Kunwar

  3. Department of Materials Engineering, KU Leuven, Kasteelpark Arenberg 44, 3001, Leuven, Belgium

    Anil Kunwar

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  1. Shengyan Shang
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Correspondence to Haitao Ma or Yunpeng Wang.

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Shang, S., Kunwar, A., Wang, Y. et al. Geometrical Effects of Cu@Ag Core–Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints. Electron. Mater. Lett. 15, 253–265 (2019). https://doi.org/10.1007/s13391-018-00116-5

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  • DOI: https://doi.org/10.1007/s13391-018-00116-5

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