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Influence of Grain Boundary Complexion on Deformation Mechanism of High Temperature Bending Creep Process of Cu Bicrystal

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Abstract

Despite of substantial advancement, the effect of grain boundary (GB) complexions on high temperature creep deformation process has not been fully understood. In this paper, we have studied the high temperature bending creep deformation of copper bicrystal with various GB complexions under different loads using molecular dynamics simulation. It has been found that specimen with normal kite GB complexion have better creep resistance properties when subjected to comparatively lower applied load. In case of monolayer Zr segregation, a drastic decrease in creep strength as well as creep plasticity is observed due to inhibition of GB migration. On the other hand, deviation between creep properties for specimen with split-kite GB complexion and split-kite bilayer Zr segregation GB complexion is minimal. Enhanced creep plasticity is observed in case of split-kite bilayer Zr segregation GB complexion, which is due to formation of interpenetrating icosahedral clusters in the necking region. Fracture in specimen with monolayer Zr segregation GB complexion has occurred by means of slip phenomenon at lower deformation load whereas amorphization and necking is observed at higher deformation load. In case of specimen with bilayer Zr segregation GB complexion, it is found that fracture has occurred through amorphization and necking at all deformation loads due to higher GB thickness.

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Acknowledgements

The authors acknowledge the computer center of National Institute of Technology Rourkela for giving access to high-performance computing facility (HPCF) required for performing this molecular dynamics study. The authors would also like to thank Ankit Surana of National Institute of Technology Rourkela for some productive discussion.

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Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Rourkela, 769008, India

    K. Vijay Reddy & Snehanshu Pal

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  1. K. Vijay Reddy
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  2. Snehanshu Pal
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Correspondence to Snehanshu Pal.

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Reddy, K.V., Pal, S. Influence of Grain Boundary Complexion on Deformation Mechanism of High Temperature Bending Creep Process of Cu Bicrystal. Trans Indian Inst Met 71, 1721–1734 (2018). https://doi.org/10.1007/s12666-018-1312-1

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  • DOI: https://doi.org/10.1007/s12666-018-1312-1

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