A Study on the Electronic Properties of SiO x N y /p-Si Interface
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In this study, we investigated the electrical properties of Sn/SiO x N y /p-Si metal-insulator layer-semiconductor (MIS) structure. Silicon oxynitride (SiO x N y ) thin film was grown on chemically cleaned p-Si substrate by the plasma nitridation process. The chemical composition and surface morphology of the thin film were analyzed using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Electrical measurements of the devices (e.g. current-voltage (I-V ), capacitance-voltage (C-V ), capacitance and conductance-frequency characteristics (C-f and G-f )) were performed at room temperature. The characteristic parameters of the SiO x N y /p-Si interface such as energy position, interface state density and relaxation time constant were obtained from admittance measurements over a wide range of frequencies (from 1 to 500 kHz) for the values of the forward bias between 0.0 V ≤ V ≤ 1.1 V. The values of the interface state density and their relaxation time constant changed from 3.684 × 1013 cm− 2 eV− 1 to 3.216 × 1012 cm− 2eV− 1 and from 1.770 × 10− 5 s to 6.277 × 10− 7 s, respectively. The obtained values of the interface state density were compared to those of the oxides grown by the other techniques. The experimental results clearly show that the density and location of interface states has a significant effect on electrical characteristics of the MIS structure.
KeywordsSilicon oxynitride Metal–insulator–semiconductor structure Schottky barrier Interface states Series resistance X-ray photoelectron spectroscopy
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This project was supported by the Erciyes University Scientific Research Project Unit under Contract No: FBA-09-1073. The authors would like to thank to the Erciyes University Scientific Research Project Unit for their financial support.
- 25.Cova P, Singh A, Masut RA (1997) A self-consistent technique for the analysis of the temperature dependence of current-voltage and capacitance-voltage characteristics of a tunnel metal-insulator-semiconductor structure. J Appl Phys 82(10):5217–5226. https://doi.org/10.1063/1.366386 CrossRefGoogle Scholar
- 27.National Institute of Standards and Technology (2012) http://srdata.nist.gov/xps/. Accessed 2017
- 41.Song YP, Vanmeirhaeghe RL, Laflere WH, Cardon F (1986) On the difference in apparent barrier height as obtained from capacitance-voltage and current-voltage-temperature measurements on Al/P-Inp Schottky barriers. Solid State Electron 29(3):633–638. https://doi.org/10.1016/0038-1101(86)90145-0 CrossRefGoogle Scholar
- 47.Rhoderick EH, Williams RH (1988) Metal-semiconductor contacts. Clarendon, OxfordGoogle Scholar
- 50.Nicollian EH, Brews JR (1982) Mos (Metal Oxide Semiconductor) physics and technology, vol 1. Wiley-Interscience, New YorkGoogle Scholar
- 55.Ma Y, Lucovsky G (1994) Deposition of single phase, homogeneous silicon oxynitride by remote plasma-enhanced chemical vapor deposition, and electrical evaluation in metal–insulator–semiconductor devices. J Vac Sci Technol B: Microelectron Nanometer Struc Process Meas Phenom 12(4):2504–2510. https://doi.org/10.1116/1.587792 CrossRefGoogle Scholar