Abstract
Electroplated diamond wire has been used to cut hard materials, such as sapphire, silicon carbide, silicon. The cutting ability of the electroplated diamond wire strongly influences the accuracy of the shape and cutting speed. The evaluation of cutting ability of the electroplated diamond wire is important to predict and determine its cutting performance. However, the cutting ability has not been adequately evaluated due to a variation in the manufacturing methods and irregular distribution of the abrasives. A cutting ability curve is proposed base on a mathematical model and experimental results achieved through a test system to evaluate the performance of the electroplated diamond wire. The results showed that the cutting ability of the electroplated diamond wire could be characterized by the cutting ability curve proposed in this study.
Similar content being viewed by others
References
Chung, C., Tsay, G. D., and Tsai, M.-H., “Distribution of Diamond Grains in Fixed Abrasive Wire Sawing Process,” The International Journal of Advanced Manufacturing Technology, Vol. 73, Nos. 9-12, pp. 1485–1494, 2014.
Suzuki, T., Nishino, Y., and Yan, J., “Mechanisms of Material Removal and Subsurface Damage in Fixed-Abrasive Diamond Wire Slicing of Single-Crystalline Silicon,” Precision Engineering, Vol. 50, pp. 32–43, 2017.
Lee, S., Kim, H., Kim, D., and Park, C., “Investigation on Diamond Wire Break-In and Its Effects on Cutting Performance in Multi-Wire Sawing,” The International Journal of Advanced Manufacturing Technology, Vol. 87, Nos. 1-4, pp. 1–8, 2016.
Kim, H., Kim, D., Kim, C., and Jeong, H., “Multi-Wire Sawing of Sapphire Crystals with Reciprocating Motion of Electroplated Diamond Wires,” CIRP Annals-Manufacturing Technology, Vol. 62, No. 1, pp. 335–338, 2013.
Wang, P., Ge, P., Gao, Y., and Bi, W., “Prediction of Sawing Force for Single-Crystal Silicon Carbide with Fixed Abrasive Diamond Wire Saw,” Materials Science in Semiconductor Processing, Vol. 63, pp. 25–32, 2017.
Kim, D., Kim, H., Lee, S., and Jeong, H., “Effect of Initial Deflection of Diamond Wire on Thickness Variation of Sapphire Wafer in Multi-Wire Saw,” International Journal of Precision Engineering and Manufacturing-Green Technology, Vol. 2, No. 2, pp. 117–121, 2015.
Argatov, I., Gómez, X., Tato, W., and Urchegui, M., “Wear Evolution in a Stranded Rope under Cyclic Bending: Implications to Fatigue Life Estimation,” Wear, Vol. 271, Nos. 11-12, pp. 2857–2867, 2011.
Lin, C.-T. and Lin, K.-L., “Effects of Current Density and Deposition Time on Electrical Resistivity of Electroplated Cu Layers,” Journal of Materials Science: Materials in Electronics, Vol. 15, No. 11, pp. 757–762, 2004.
Chiba, Y., Tani, Y., Enomoto, T., and Sato, H., “Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools,” CIRP Annals-Manufacturing Technology, Vol. 52, No. 1, pp. 281–284, 2003.
Chung, C. and Nhat, L. V., “Generation of Diamond Wire Sliced Wafer Surface Based on the Distribution of Diamond Grits,” International Journal of Precision Engineering and Manufacturing, Vol. 15, No. 5, pp. 789–796, 2014.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Kim, DY., Lee, TK., Park, CJ. et al. Evaluation of Cutting Ability of Electroplated Diamond Wire Using a Test System and Theoretical Approach. Int. J. Precis. Eng. Manuf. 19, 553–560 (2018). https://doi.org/10.1007/s12541-018-0067-2
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12541-018-0067-2