In this work, 0.5 mol L−1 HCl and 0.13 mol L−1 FeCl3 have been used as leaching solution of industrially wasted copper at room temperature. Copper recovery from the leaching solution has been studied by batch electrodeposition at room temperature and either by using different constant current densities or by pulsing the current. The deposits obtained at 20 mA cm−2 show low efficiencies and are mainly composed of Cu0 with CuCl being a minor component. When the deposits are obtained at 50 mA cm−2, the efficiency is higher, but the adherence is poor and the porosity is high. By using pulsed electrodeposition, it is possible to improve the adherence of the deposits. However, the deposits are contaminated with copper and iron oxides, as well as with chloride compounds. Tin was not detected in any of the deposits obtained using all the electrodeposition conditions tested in this work.
This is a preview of subscription content, log in to check access.
Buy single article
Instant access to the full article PDF.
Price includes VAT for USA
Subscribe to journal
Immediate online access to all issues from 2019. Subscription will auto renew annually.
This is the net price. Taxes to be calculated in checkout.
K. Koyama, M. Tanaka, and J.C. Lee, Mater. Trans. 47, 1788 (2006).
S. Fogarasi, F. Imre-Lucaci, A. Imre-Lucaci, and P. Ilea, J. Hazard. Mater. 273, 215 (2014).
J.W. Dini, Electrodeposition of Copper—Modern Electroplating, 4th ed. (New York: Wiley, 2000), pp. 33–78.
T. Oishi, K. Koyama, T. Alam, M. Tanaka, and J.C. Lee, Hydrometallurgy 89, 82 (2007).
Z. Sun, Y. Xiao, J. Sietsma, H. Agterhuis, and Y. Yang, Environ. Sci. Technol. 49, 7981 (2015).
A.C. Kasper, G.B.T. Berselli, B.D. Freitas, J.A.S. Tenório, A.M. Bernardes, and H.M. Veit, Waste Manag. 31, 2536 (2011).
H.M. Veit, A.M. Bernardes, J.Z. Ferreira, J.A.S. Tenorio, and C.D.F. Malfatti, J. Hazard. Mater. 137, 1704 (2006).
F. Li, M. Chen, J. Shu, M. Shirvani, Y. Li, Z. Sun, S. Sun, Z. Xu, K. Fu, and S. Chen, J. Cleaner Prod. 213, 673 (2019).
S. Fogarazi, F. Imre-Lucai, A. Egedy, A. Imre-Lucaci, and P. Ilea, Waste Manag. 40, 136 (2015).
E.Y. Yazici and H. Deveci, Int. J. Miner. Process. 133, 39 (2014).
E. Kim, M. Kim, J. Lee, J. Jeong, and B.D. Pandey, Hydrometallurgy 107, 124 (2011).
R. Torres and G.T. Lapidus, Waste Manag. 57, 131 (2016).
S. Silva-Martinez and S. Roy, Sep. Purif. Technol. 118, 6 (2013).
F.P.C. Silvas, M.M.J. Correa, M.P.K. Caldas, V.T.D. Moraes, D.C.R. Espinosa, and J.A.S. Tenório, Waste Manag. 46, 503 (2015).
C. Cocchiara, S.A. Dormenau, R. Inguanta, C. Sunseri, and P. Ilea, J. Clean. Prod. 230, 170 (2019).
I. Birloaga, I.D. Michelis, F. Ferella, M. Buzatu, and F. Vegliò, Waste Manag. 33, 935 (2013).
R.A. Day and A.L. Underwood, Quimica Analítica Cuantitativa (Mexico: Prentice-Hall Hispanoamericana, 1989).
M.J. Kim, S.K. Cho, H.C. Koo, T. Lim, K.J. Park, and J.J. Kim, J. Electrochem. Soc. 157, D564 (2010).
V. Chandrasekar and M. Pushpavanam, Electrochim. Acta 53, 3313 (2008).
D.R. Lide, Handbook of Chemistry and Physics (Boca Raton: CRC, 1998).
B.D. Cullity, Element of X-Ray Difraction (Reading: Adison-Wesley, 1956).
Y.S. Gong, C. Lee, and C.K. Yang, J. Appl. Phys. 77, 5422 (1995).
D.L.A.D. Faria, S.V. Silva, and M.T.D. Oliveira, J. Raman Spectrosc. 28, 873 (1997).
L. Yohai, W.H. Schreiner, M. Vázquez, and M.B. Valcarc, Appl. Surf. Sci. 257, 9689 (2011).
W. Shao, G. Pattanaik, and G. Zangari, J. Electrochem. Soc. 154, D201 (2007).
P. Sebastián, E. Torralba, E. Vallés, A. Molina, and E. Gómez, Electrochim. Acta 164, 187 (2015).
R. Frost, Spectrochim. Acta Part A 59, 1195 (2003).
P.T. Huyen, T.D. Dang, M.T. Tung, N.T.T. Huyen, T.A. Green, and S. Roy, Hydrometallurgy 164, 295 (2016).
J.C. Hamilton, J.C. Farmer, and R.J. Anderson, J. Electrochem. Soc. 133, 739 (1986).
This work has been supported by the following institutions in Argentina: University of Mar del Plata (Grant 15/G351), National Research Council (CONICET, PIP0661) and Agencia Nacional de Promoción Científica y Tecnológica (PICT 0972/15).
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Electronic supplementary material
Below is the link to the electronic supplementary material.
About this article
Cite this article
Masari, F., Ceré, S. & Valcarce, M.B. Copper Recovery from Printed Circuit Boards Using Acidic Ferric Chloride Leaching and Electrodeposition. JOM (2020). https://doi.org/10.1007/s11837-020-04236-y