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In-situ Indentation and Correlated Precession Electron Diffraction Analysis of a Polycrystalline Cu Thin Film

  • Mechanical Behavior at the Nanoscale
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Abstract

In-situ TEM nanoindentation of a polycrystalline Cu film was cross-correlated with precession electron diffraction (PED) to quantify the microstructural evolution. The use of PED is shown to clearly reveal features, such as grain size, that are easily masked by diffraction contrast created by the deformation. Using PED, the accompanying grain refinement and change in texture as well as the preservation of specific grain boundary structures, including a ∑3 boundary, under the indent impression were quantified. The nucleation of dislocations, evident in low-angle grain boundary formations, was also observed under the indent. PED quantification of texture gradients created by the indentation process linked well to bend contours observed in the bright-field images. Finally, PED enabled generating a local orientation spread map that gave an approximate estimation of the spatial distribution of strain created by the indentation impression.

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Acknowledgements

The authors gratefully acknowledge ARO W911NF-17-1-0528, Dr. Michael Bakas Program Manager. The Bruker PI-95 indenter was acquired through the NSF-DMR-1531722.

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Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL, 35487, USA

    Qianying Guo & Gregory B. Thompson

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  1. Qianying Guo
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  2. Gregory B. Thompson
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Correspondence to Gregory B. Thompson.

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Guo, Q., Thompson, G.B. In-situ Indentation and Correlated Precession Electron Diffraction Analysis of a Polycrystalline Cu Thin Film. JOM 70, 1081–1087 (2018). https://doi.org/10.1007/s11837-018-2854-8

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  • DOI: https://doi.org/10.1007/s11837-018-2854-8

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