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Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer

Ti/Cu/Nb 作中间层脉冲加压瞬间液相连接TiC 金属陶瓷与不锈钢

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Abstract

Partial transient liquid phase (PTLP) bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885 °C under a pulsed pressure of 2–10 MPa within durations in the range of 2–8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the σ phase with a limit solubility of Nb, a sequence of Ti—Cu intermetallic phases and solid solutions of Ni and Cu in α+β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 min, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti—Cu intermetallics interface and spread to the interior of TiC cermet in a brittle cleavage manner.

摘要

部分瞬间液相焊接(PTLP)综合了钎焊和固相扩散连接的优点,且对连接母材表面粗糙度比 传统固相连接相对较低,因此在陶瓷和金属异种材料连接方向上具有较大的优势。采用Ti—Cu—Nb 金 属中间层,对TiC 金属陶瓷与06Cr19Ni10 不锈钢进行PTLP 连接试验。通过SEM、EDS、XRD 和拉 伸试验等方法,研究了活性元素中间层、工艺参数对TiC/TiCuNb/06Cr19Ni10 瞬间液相焊接头性能与 界面微观结构的影响规律。结果表明,在连接温度885 °C、脉冲压力2~10 MPa 的工艺条件下保温5 min 时接头剪切强度达到最大值(~106.7 MPa)。微观组织表征发现,在TiC 金属陶瓷一侧,Ti—Cu 层在高 于共晶点的连接温度时发生熔化,与TiC 金属陶瓷、核心金属层Nb 产生界面反应;而在304SS 侧, Nb 与304SS 进行固相扩散, 形成具有固相扩散特征的连接结构, 连接后界面形成 06Cr19Ni10/σ/Nb/CuTi/CuTi2/α+βTi/TiC 过渡结构。连接接头的裂纹沿着Ti—Cu 金属化合物层向TiC 陶 瓷母材扩展,呈脆性解理断裂特征。

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Authors and Affiliations

  1. College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

    Li Huang  (黄利), Guang-min Sheng  (盛光敏), Guang-jie Huang  (黄光杰) & Xin-jian Yuan  (袁新建)

  2. Changan Commercial Vehicle Business Department, China Changan Automobile Group, Chongqing, 400023, China

    Jia Li  (李佳)

Authors
  1. Li Huang  (黄利)
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  2. Guang-min Sheng  (盛光敏)
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  3. Jia Li  (李佳)
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  4. Guang-jie Huang  (黄光杰)
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  5. Xin-jian Yuan  (袁新建)
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Corresponding author

Correspondence to Guang-min Sheng  (盛光敏).

Additional information

Foundation item: Project(51421001) supported by the National Natural Science Foundation of China; Projects(106112015CDJXZ138803, 106112015CDJXY130003) supported by the Fundamental Research Funds for the Central Universities, China

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Huang, L., Sheng, Gm., Li, J. et al. Partial transient-liquid-phase bonding of TiC cermet to stainless steel using impulse pressuring with Ti/Cu/Nb interlayer. J. Cent. South Univ. 25, 1025–1032 (2018). https://doi.org/10.1007/s11771-018-3802-z

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  • DOI: https://doi.org/10.1007/s11771-018-3802-z

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