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Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

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Abstract

The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h, the Cu3Sn IMC is then obtained. With increasing aging time, the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%, mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy, the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5, the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, China

    Bin Lu  (卢 斌), Hui Li  (栗 慧), Juan-hui Wang  (王娟辉), Hua-wei Zhu  (朱华伟) & Xian-he Jiao  (焦羡贺)

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  1. Bin Lu  (卢 斌)
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  2. Hui Li  (栗 慧)
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  3. Juan-hui Wang  (王娟辉)
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  4. Hua-wei Zhu  (朱华伟)
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  5. Xian-he Jiao  (焦羡贺)
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Corresponding author

Correspondence to Bin Lu  (卢 斌).

Additional information

Foundation item: Project(06GK2002) supported by the Major Project of Hunan Provincial Science and Technology Development Strategy

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Lu, B., Li, H., Wang, Jh. et al. Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate. J. Cent. South Univ. Technol. 15, 313–317 (2008). https://doi.org/10.1007/s11771-008-0059-y

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  • DOI: https://doi.org/10.1007/s11771-008-0059-y

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