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Recent development and application of thin-film thermoelectric cooler

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Abstract

Recently, the performance and fabrication of thin-film thermoelectric materials have been largely enhanced. Based on this enhancement, the thin-film thermoelectric cooler (TEC) is becoming a research hot topic, due to its high cooling flux and microchip level size. To fulfill a thin-film TEC, interfacial problems are unavoidable, as they may largely reduce the properties of a thin-film TEC. Moreover, the architecture of a thin-film TEC should also be properly designed. In this review, we introduced the enhancement of thermoelectric properties of (Bi,Sb)2(Te,Se)3 solid solution materials by chemical vapor deposition, physical vapor deposition and electrodeposition. Then, the interfacial problems, including contact resistance, interfacial diffusion and thermal contact resistance, were discussed. Furthermore, the design, fabrication, as well as the performance of thin-film TECs were summarized.

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Acknowledgements

The work was supported by the State Key Program of National Natural Science Foundation of China (Grant No. 61534001), the Joint Funds of the National Natural Science Foundation of China (Grant No. U1601213), the National Natural Science Foundation of China (Grant Nos. 51601005 and 61704006), the Beijing Natural Science Foundation (Grant No. 2182032) and the Fundamental Research Funds for the Central Universities.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Beihang University, Beijing, 100083, China

    Yuedong Yu, Wei Zhu, Xixia Kong, Yaling Wang, Pengcheng Zhu & Yuan Deng

  2. Beijing Advanced Innovation Center for Biomedical Engineering, Beihang University, Beijing, 100083, China

    Wei Zhu & Yuan Deng

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  1. Yuedong Yu
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  2. Wei Zhu
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Correspondence to Wei Zhu or Yuan Deng.

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Yu, Y., Zhu, W., Kong, X. et al. Recent development and application of thin-film thermoelectric cooler. Front. Chem. Sci. Eng. 14, 492–503 (2020). https://doi.org/10.1007/s11705-019-1829-9

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