Abstract
While most of the industries are striving very hard to produce totally lead-free electronic products, many concerns remain regarding lead-free solder joint reliability. One major concern is the robustness of gold metallization of the electronic components for lead-free soldering. Increasing gold content has been known to result in embrittlement and early failure in electronic assemblies. Therefore, information about the lead-free solder/gold metallization interdiffusion at high-temperature applications is very important for controlling the technological processes for the reliability of the electronic interconnects. The challenges of solder/gold metallization interdiffusion during high-temperature application/test are gold embrittlement, intermetallics growth, void formation, and also tin-whisker formation. This paper illustrates few case histories of such challenges. Importance of the thickness of the gold termination has been discussed and some parameters to optimizing the thickness of the gold termination have been suggested. Some remedial measures are suggested to control the lead-free solder/gold metallization diffusion in the electronics interconnects.
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References
Darveaux, R., et al.: In: Lau, J. (ed.) Ball Grid Array Technology, chap. 13 (1995)
Zhong, C.H., et al.: Missing solder ball failure mechanism in plastic ball grid array packages, ECTC 200, pp. 151–159
Ferguson, M.E., et al.: Manufacturing concerns when soldering with gold plated component leads or circuit board pads. IEEE Trans. Comp. Packag. Manuf. Technol. C 20(3), 186–193 (1997)
Kramer, P.A., et al.: The effect of low Au concentration on the creep of eutectic Sn-Pb joints. Metall. Mater. Trans. A 25A, 1249–1255 (1994)
Kim, P.G., et al.: Fast soldering reactions on Au foils. Materials Research Society, Symposium Proceedings, vol. 445, pp. 131–136 (1997)
Mei, Z., et al.: Brittle interfacial fracture of PBGA packages soldered on electroless Ni/Immersion gold, Hewlett-Packard Company
Dunford, S.O., et al.: Microstructural evolution and damage mechanisms in Pb-free solder joints during extended −40 to 125°C thermal cycles, IPC 2002, New Orleans, LA, Nov 2–3 (2002)
Meilunas, M., et al.: Reliability and failure analysis of lead-free solder joints, IPC 2002, New Orleans, LA, Nov 2–3 (2002)
Zeng, K., et al.: Formation of intermetallic compounds in solder joints and its effects on joint reliability, Helsinki University of Technology, Report Series HUT-EPT-2 2000, ISBN 951-22-4980-4
Dunford, S., et al.: Metallurgical and reliability aspects of lead-free mixed technology electronic assembly for mobile communication products, IPC Works 2000, Miami, FL, Sept 9–14 (2000)
Zheng, Y., et al.: Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu. Proceedings of ECTC 2002, San Diego, CA, May 28–31 (2002)
Zeng, K., et al.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. Rep. (Invited), 38(2), 55–105 (2002)
Brusse, J.: Tin whisker observations on pure tin-plated ceramic chip capacitors. AESFSUR/FIN Proceedings, pp. 45–61, June 24–27 (2002)
NASA Goddard Space Flight Center, Basic Info/FAQ. http://nepp.nasa.gov/whisker/background/
Zhang, Y., Xu, C., Abys, J., Vysotskaya, A.: Understanding whisker phenomenon, whisker index and tin/copper, tin/nickel interface, IPC, SMEMA Council APEX (2002)
Kadeshch, J., Brusse, J.: The continuing dangers of tin whiskers and attempt to control them with conformal coating. EEE Links, 1(2), July (2001)
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Asrar, N. Detrimental Effects of Excessive Gold Plating on Lead-Free Solder Joints. J Fail. Anal. and Preven. 10, 50–55 (2010). https://doi.org/10.1007/s11668-009-9305-3
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DOI: https://doi.org/10.1007/s11668-009-9305-3