In electronic package design, solder joints are critical in providing electrical connections and mechanical support. The mechanical reliability of interconnection is dependent on the microstructure evolution that occurs within the solder due to the temperature changes primarily from transportation, storage, and device usage. In this study, two solder alloys, eutectic 63Sn37Pb and lead-free 95.5Sn4.0Ag0.5Cu, were tested for their thermal fatigue reliability and were observed for changes in microstructure. The different microstructures of each sample were created by controlling the cooling rate, fast or slow, during reflow. To characterize reliability, the samples endured thermal cycling − 40-125 °C until electrical failure. Finite element analysis was used to predict the primary deformation mechanism. The microstructure was inspected by cross-sectioning the solder samples using scanning electron microscopy with energy-dispersive x-ray spectroscopy. It was found that by controlling the microstructure development through the reflow rate, the solder joint’s thermal fatigue life can be extended, and concurrently, the reliability of the electronic package can be enhanced.
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S. Zhang, X. Xu, T. Lin, and P. He, Recent Advances in Nano-Materials for Packaging of Electronic Devices, J. Mater. Sci. Mater. Electron., 2019, 30(15), p 13855–13868
S. Zhang and K.-W. Paik, A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling, IEEE Trans. Compon. Packag. Manuf. Technol., 2016, 6(2), p 216–223
A. Longford, Chip Packaging Challenges… A Roadmap Based Overview, Microelectron. Int., 2005, 22(2), p 17–20
I. Kim and S.B. Lee, Fatigue Life Evaluation of Lead-Free Solder Under Thermal and Mechanical Loads, in Proceedings—Electronic Components and Technology Conference, (Reno, NV) (2007), pp. 95–104
M. McCormack and S. Jin, New, Lead-Free Solders, J. Electron. Mater., 1994, 23(7), p 635–640
K. Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Opin. Solid State Mater. Sci., 2001, 5(1), p 55–64
D. Shangguan, Lead-Free Solder Interconnect Reliability, ASM International, Cleveland, 2005
S. Zhang, B. Zhu, X. Zhou, X. Wang, T. Lin, P. He, and K.W. Paik, Wettability and Interfacial Morphology of Sn-3.0Ag-0.5Cu Solder on Electroless Nickel Plated ZnS Transparent Ceramic, J. Mater. Sci. Mater. Electron., 2019, 30(19), p 17972–17985
S. Li, X. Wang, Z. Liu, Y. Jiu, S. Zhang, J. Geng, X. Chen, S. Wu, P. He, and W. Long, Corrosion Behavior of Sn-Based Lead-Free Solder Alloys: A Review, J. Mater. Sci. Mater. Electron., 2020, 31, p 1–15
M. Li, K.Y. Lee, D.R. Olsen, W.T. Chen, B.T.C. Tan, and S. Mhaisalkar, Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages, IEEE Trans. Electron. Packag. Manuf., 2002, 25(3), p 185–192
D.R. Frear, Microstructural Evolution During Thermomechanical Fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb Solder Joints, IEEE Trans. Compon. Hybrids Manuf. Technol., 1990, 13(4), p 718–726
J.H.L. Pang, T.H. Low, B.S. Xiong, X. Luhua, and C.C. Neo, Thermal Cycling Aging Effects on Sn-Ag-Cu Solder Joint Microstructure, IMC and Strength, Thin Solid Films, 2004, 462-463(SPEC. ISS.), p 370–375
H.L.J. Pang, K.H. Tan, X.Q. Shi, and Z.P. Wang, Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, Mater. Sci. Eng. A, 2001, 307(1-2), p 42–50
J.H.L. Pang, K.H. Tan, X. Shi, and Z.P. Wang, Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen, IEEE Trans. Compon. Packag. Technol., 2001, 24(1), p 10–15
S. Nurmi, J. Sundelin, E. Ristolainen, and T. Lepistö, The Effect of Solder Paste Composition on the Reliability of SnAgCu Joints, Microelectron. Reliab., 2004, 44(3), p 485–494
C.K. Lin and D.Y. Chu, Creep Rupture of Lead-Free Sn-3.5Ag and Sn-3.5Ag-0.5Cu Solders, J. Mater. Sci. Mater. Electron., 2005, 16(6), p 355–365
S. Wiese and K.J. Wolter, Microstructure and Creep Behaviour of Eutectic SnAg and SnAgCu Solders, Microelectron. Reliab., 2004, 44(12), p 1923–1931
V.I. Igoshev, J.I. Kleiman, D. Shangguan, S. Wong, and U. Michon, Fracture of Sn-3.5%Ag Solder Alloy under Creep, J. Electron. Mater., 2000, 29(12), p 1356–1361
D.K. Joo, J. Yu, and S.W. Shin, Creep Rupture of Lead-Free Sn-3.5Ag-Cu Solders, J. Electron. Mater., 2003, 32(6), p 541–547
J.J. Sundelin, S.T. Nurmi, T.K. Lepistö, and E.O. Ristolainen, Microstructure, Creep Properties, and Failure Mechanism of SnAgCu Solder Joints, J. Electron. Mater., 2006, 35(7), p 1600–1606
C. Kanchanomai, Y. Miyashita, and Y. Mutoh, Low Cycle Fatigue Behavior and Mechanisms of a Eutectic Sn-Pb Solder 63Sn/37Pb, Int. J. Fatigue, 2002, 24(6), p 671–683
S.H. Fan, Y.C. Chan, C.W. Tang, and J.K.L. Lai, Aging Studies of PBGA Solder Joints Reflowed at Different Conveyor Speeds, IEEE Trans. Adv. Packag., 2001, 24(4), p 486–492
J.H. Constable, W. Butler, C. Huang, and J.M. Pitarresi, CSP Fatigue Life Predictions Based on Electrical Resistance Change, Adv. Electron. Packag., 2001, 1, p 1–7
Temperature Cycling 22-A104-B, JEDEC Standard, JEDEC Solid State Technology Association (2005)
M. Yunus, K. Srihari, J.M. Pitarresi, and A. Primavera, Effect of Voids on the Reliability of BGA/CSP Solder Joints, Microelectron. Reliab., 2003, 43(12), p 2077–2086
B.Z. Hong, Thermal Fatigue Analysis of a CBGA Package with Lead-Free Solder Fillets in Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, (Seattle, WA) (IEEE, 1998), pp. 205–211
B.Z. Hong, Finite Element Modeling of Thermal Fatigue and Damage of Solder Joints in a Ceramic Ball Grid Array Package, J. Electron. Mater., 1997, 26(7), p 814–820
J. Lau, W. Dauksher, and P. Vianco,“Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders and Joints, in 53rd Electronic Components and Technology Conference, (New Orleans, Louisiana) (2003), pp. 229–236
Y. Zhang, H. Zhu, M. Fujiwara, J. Xu, and M. Dao, Low-Temperature Creep of SnPb and SnAgCu Solder Alloys and Reliability Prediction in Electronic Packaging Modules, Scr. Mater., 2013, 68(8), p 607–610
B. Wong, D.E. Helling, and R.W. Clark, A Creep-Rupture Model for Two-Phase Eutectic Solders, IEEE Trans. Compon. Hybrids Manuf. Technol., 1988, 11(3), p 284–290
P. Sharma and A. Dasgupta, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation, J. Electron. Packag. Trans. ASME, 2002, 124(3), p 292–297
M.N. Islam, Y.C. Chan, M.J. Rizvi, and W. Jillek, Investigations of Interfacial Reactions of Sn-Zn Based and Sn-Ag-Cu Lead-Free Solder Alloys as Replacement for Sn-Pb Solder, J. Alloys Compd., 2005, 400(1-2), p 136–144
J.W. Yoon, B.I. Noh, B.K. Kim, C.C. Shur, and S.B. Jung, Wettability and Interfacial Reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu Solder Joints, J. Alloys Compd., 2009, 486(1-2), p 142–147
P. Sun, C. Andersson, X. Wei, Z. Cheng, D. Shangguan, and J. Liu, Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish after Reflow Soldering, in 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP’06, (Shanghai) (2006), pp. 287–291
K.J. Puttlitz and K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, CRC Press, Boca Raton, 2004
S. Zhang, M. Yang, Y. Wu, J. Du, T. Lin, P. He, M. Huang, and K.W. Paik, A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature, IEEE Trans. Compon. Packag. Manuf. Technol., 2018, 8(3), p 383–391
S. Zhang, T. Lin, P. He, and K.W. Paik, Effects of Acrylic Adhesives Property and Optimized Bonding Parameters on Sn-58Bi Solder Joint Morphology for Flex-on-Board Assembly, Microelectron. Reliab., 2017, 78, p 181–189
JER was supported by the new faculty start-up fund at NCSU. EYS thanks the NCSU MAE Undergraduate Research Scholars Award for support.
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Seo, E.Y., Ryu, J.E. Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints. J. of Materi Eng and Perform (2020). https://doi.org/10.1007/s11665-020-04899-3
- intermetallic compound
- solder ball
- thermal fatigue