Journal of Materials Engineering and Performance

, Volume 26, Issue 4, pp 1741–1750 | Cite as

Effect of Sulfide Concentration on Copper Corrosion in Anoxic Chloride-Containing Solutions

  • Decheng Kong
  • Chaofang Dong
  • Aoni Xu
  • Cheng Man
  • Chang He
  • Xiaogang Li
Article

Abstract

The structure and property of passive film on copper are strongly dependent on the sulfide concentration; based on this, a series of electrochemical methods were applied to investigate the effect of sulfide concentration on copper corrosion in anaerobic chloride-containing solutions. The cyclic voltammetry and x-ray photoelectron spectroscopy analysis demonstrated that the corrosion products formed on copper in anaerobic sulfide solutions comprise Cu2S and CuS. And the corrosion resistance of copper decreased with increasing sulfide concentration and faster sulfide addition, owing to the various structures of the passive films observed by the atomic force microscope and scanning electron microscope. A p-type semiconductor character was obtained under all experimental conditions, and the defect concentration, which had a magnitude of 1022–1023 cm−3, increased with increasing sulfide concentration, resulting in a higher rate of both film growth and dissolution.

Keywords

copper electrochemical impedance spectroscopy passive film sulfide 

Notes

Acknowledgments

The authors would like to gratefully acknowledge the financial support from the National Natural Science Foundation of China (No. 51222106) and the Fundamental Research Funds for the Central Universities (No. FRF-TP-14-011C1) and National Basic Research Program of China (973 Program) (No. 2014CB643300).

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Copyright information

© ASM International 2017

Authors and Affiliations

  • Decheng Kong
    • 1
  • Chaofang Dong
    • 1
  • Aoni Xu
    • 1
  • Cheng Man
    • 1
  • Chang He
    • 1
  • Xiaogang Li
    • 1
  1. 1.Corrosion and Protection Center, Key Laboratory for Corrosion and Protection (MOE)University of Science and Technology BeijingBeijingChina

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