In order to discuss the effects of Cu-cored solder with pure Ni coating and joint height on the interfacial microstructure and mechanical properties of joints, Cu/Sn-3.0Ag0.5Cu (SAC305)/Cu and Cu/Cu-cored + SAC305/Cu sandwich solder joints were prepared using a reflow process. The interfacial microstructure of the solder joints was investigated by scanning electron microscope with energy-dispersive x-ray spectroscopy. The results showed that, at as-reflowed joints, an intermetallic compound (IMC) of scallop-like Cu6Sn5 was formed at the Cu wire/solder interface, and a plane-like (Cux, &!nbsp;Ni1−x)6Sn5 IMC was formed at the Cu core/solder interface. Compared with SAC305 solder joints, Cu-cored solder joints showed more interface layers, a thicker Cu6Sn5 IMC layer, and higher tensile strength. With increasing joint height, the thickness of the IMC at the two interfaces decreased, and the tensile strength also decreased for Cu-cored solder joints. Mixed brittle/ductile fracture appeared in SAC305 and Cu-cored solder joints with height of 600 μm, but were suppressed and transformed into ductile fractures with increasing height of the solder joints.
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L.M. Yin, S. Wei, Z.L. Xu, and Y.F. Geng, J. Mater. Sci.: Mater. Electron. 24, 1369 (2013).
J. Xia, L.Y. Huang, Q.X. Liu, Q. Peng, H.W. Xu, and S.Y. Wei, Semicond. Technol. 43, 148 (2018).
D.L. Li, G.Q. Wei, and L. Liu, Spec. Cast and Nonferrous Alloys. 38, 461 (2018).
L. Sun, M.H. Chen, C.C. Wei, L. Zhang, and F. Yang, J. Mater. Sci.: Mater. Electron. 29, 9757 (2018).
H. Tanie, N. Chiwata, M. Wakano, and M. Fujiyoshi, T Itabashi, in ASME Inter PACK Conference Proceedings. 797 (2009).
D. Li, L.M. Yin, Z.X. Yao, G. Wang, L.P. Zhang, and C.X. Wang, in ICEPT Conference Proceedings. 513(2017).
K. Uenishi, Y. Kohara, and S. Sakatani, Mater. Trans. 43, 1833 (2002).
J.W. Nah, S.L. Buchwalter, P.A. Gruber, D.Y. Shin, and B.K. Furman, in ECTC Conference Proceedings. 1351 (2008).
S. Sakatani, T. Saeki, Y. Kohara, K. Uenishi, K.F. Kobayashi, and M. Yamamoto, Jpn. Inst. Electron. Packag. 6, 509 (2003).
C.M. Chen and H.C. Lin, J. Electron. Mater. 35, 1937 (2006).
Y. Kim, H. Choi, H. Lee, D. Shin, J. Moon, and H. Choe, J. Mater. Sci. 46, 6897 (2011).
X.Z. Sa and P. Wu, J. Electron. Mater. 42, 2641 (2013).
W.K. Mu, W. Zhou, B.L. Li, and P. Wu, Mater. Chem. Phys. 163, 985 (2012).
L.M. Yin, M. Pecht, S. Wei, Y.F. Geng, and Z.X. Yao, Trans. China. Weld. Inst. 34, 27 (2013).
S.J. Shang, K. Cui, Y.T. Zhao, C.Y. Hou, and F. Chen, Electron Compd. Mater. 38, 41 (2019).
H. Xiao, X.Y. Li, and F.H. Li, J. Mater. Eng. 10, 38 (2010).
D.Q. Yu, L.L. Duan, J. Zhao, L. Wang, and C.M.L. Wu, Mater. Sci. Technol. 13, 532 (2005).
Y. Zhu and F.L. Sun, Solder Surf. Mount Technol. 29, 85 (2017).
F.L. Sun and Y. Zhu, J. Harbin. Univ. Sci. Technol. 17, 100 (2012).
L.M. Yin, X.P. Zhang, and C. Lu, J. Electron. Mater. 38, 2179 (2009).
D.A.A. Shnawah, M.F.M. Sabri, I.A. Badruddin, S.B.M. Said, and F.X. Che, J. Mater. Sci.: Mater. Electron. 23, 1988 (2012).
This work was supported by the National Natural Science Foundation of China (No. 51674056), Natural Science Foundation of Chongqing (Nos. cstc2019jcyj-msxmX0175, and cstc2018jcyjAX0108), National innovation training program for College Students (No. 201911551005), the Program for Creative Research Groups in University of Chongqing (Grant No. CXQT19031), and Chongqing Technology Innovation and application demonstration project (No. csct2018jszx-cyzdX0127).
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Yao, Z., Jiang, S., Yin, L. et al. Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints. Journal of Elec Materi (2020). https://doi.org/10.1007/s11664-020-08273-w
- Cu-cored solder joint
- height effect
- intermetallic compound (IMC)
- mechanical property
- fracture mode