Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints


In order to discuss the effects of Cu-cored solder with pure Ni coating and joint height on the interfacial microstructure and mechanical properties of joints, Cu/Sn-3.0Ag0.5Cu (SAC305)/Cu and Cu/Cu-cored + SAC305/Cu sandwich solder joints were prepared using a reflow process. The interfacial microstructure of the solder joints was investigated by scanning electron microscope with energy-dispersive x-ray spectroscopy. The results showed that, at as-reflowed joints, an intermetallic compound (IMC) of scallop-like Cu6Sn5 was formed at the Cu wire/solder interface, and a plane-like (Cux, &!nbsp;Ni1−x)6Sn5 IMC was formed at the Cu core/solder interface. Compared with SAC305 solder joints, Cu-cored solder joints showed more interface layers, a thicker Cu6Sn5 IMC layer, and higher tensile strength. With increasing joint height, the thickness of the IMC at the two interfaces decreased, and the tensile strength also decreased for Cu-cored solder joints. Mixed brittle/ductile fracture appeared in SAC305 and Cu-cored solder joints with height of 600 μm, but were suppressed and transformed into ductile fractures with increasing height of the solder joints.

This is a preview of subscription content, log in to check access.


  1. 1.

    L.M. Yin, S. Wei, Z.L. Xu, and Y.F. Geng, J. Mater. Sci.: Mater. Electron. 24, 1369 (2013).

    CAS  Google Scholar 

  2. 2.

    J. Xia, L.Y. Huang, Q.X. Liu, Q. Peng, H.W. Xu, and S.Y. Wei, Semicond. Technol. 43, 148 (2018).

    Google Scholar 

  3. 3.

    D.L. Li, G.Q. Wei, and L. Liu, Spec. Cast and Nonferrous Alloys. 38, 461 (2018).

    Google Scholar 

  4. 4.

    L. Sun, M.H. Chen, C.C. Wei, L. Zhang, and F. Yang, J. Mater. Sci.: Mater. Electron. 29, 9757 (2018).

    CAS  Google Scholar 

  5. 5.

    H. Tanie, N. Chiwata, M. Wakano, and M. Fujiyoshi, T Itabashi, in ASME Inter PACK Conference Proceedings. 797 (2009).

  6. 6.

    D. Li, L.M. Yin, Z.X. Yao, G. Wang, L.P. Zhang, and C.X. Wang, in ICEPT Conference Proceedings. 513(2017).

  7. 7.

    K. Uenishi, Y. Kohara, and S. Sakatani, Mater. Trans. 43, 1833 (2002).

    CAS  Article  Google Scholar 

  8. 8.

    J.W. Nah, S.L. Buchwalter, P.A. Gruber, D.Y. Shin, and B.K. Furman, in ECTC Conference Proceedings. 1351 (2008).

  9. 9.

    S. Sakatani, T. Saeki, Y. Kohara, K. Uenishi, K.F. Kobayashi, and M. Yamamoto, Jpn. Inst. Electron. Packag. 6, 509 (2003).

    CAS  Article  Google Scholar 

  10. 10.

    C.M. Chen and H.C. Lin, J. Electron. Mater. 35, 1937 (2006).

    CAS  Article  Google Scholar 

  11. 11.

    Y. Kim, H. Choi, H. Lee, D. Shin, J. Moon, and H. Choe, J. Mater. Sci. 46, 6897 (2011).

    CAS  Article  Google Scholar 

  12. 12.

    X.Z. Sa and P. Wu, J. Electron. Mater. 42, 2641 (2013).

    CAS  Article  Google Scholar 

  13. 13.

    W.K. Mu, W. Zhou, B.L. Li, and P. Wu, Mater. Chem. Phys. 163, 985 (2012).

    Article  Google Scholar 

  14. 14.

    L.M. Yin, M. Pecht, S. Wei, Y.F. Geng, and Z.X. Yao, Trans. China. Weld. Inst. 34, 27 (2013).

    Google Scholar 

  15. 15.

    S.J. Shang, K. Cui, Y.T. Zhao, C.Y. Hou, and F. Chen, Electron Compd. Mater. 38, 41 (2019).

    Google Scholar 

  16. 16.

    H. Xiao, X.Y. Li, and F.H. Li, J. Mater. Eng. 10, 38 (2010).

    Google Scholar 

  17. 17.

    D.Q. Yu, L.L. Duan, J. Zhao, L. Wang, and C.M.L. Wu, Mater. Sci. Technol. 13, 532 (2005).

    CAS  Google Scholar 

  18. 18.

    Y. Zhu and F.L. Sun, Solder Surf. Mount Technol. 29, 85 (2017).

    Article  Google Scholar 

  19. 19.

    F.L. Sun and Y. Zhu, J. Harbin. Univ. Sci. Technol. 17, 100 (2012).

    CAS  Google Scholar 

  20. 20.

    L.M. Yin, X.P. Zhang, and C. Lu, J. Electron. Mater. 38, 2179 (2009).

    CAS  Article  Google Scholar 

  21. 21.

    D.A.A. Shnawah, M.F.M. Sabri, I.A. Badruddin, S.B.M. Said, and F.X. Che, J. Mater. Sci.: Mater. Electron. 23, 1988 (2012).

    CAS  Google Scholar 

Download references


This work was supported by the National Natural Science Foundation of China (No. 51674056), Natural Science Foundation of Chongqing (Nos. cstc2019jcyj-msxmX0175, and cstc2018jcyjAX0108), National innovation training program for College Students (No. 201911551005), the Program for Creative Research Groups in University of Chongqing (Grant No. CXQT19031), and Chongqing Technology Innovation and application demonstration project (No. csct2018jszx-cyzdX0127).

Author information



Corresponding author

Correspondence to Limeng Yin.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and Permissions

About this article

Verify currency and authenticity via CrossMark

Cite this article

Yao, Z., Jiang, S., Yin, L. et al. Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints. Journal of Elec Materi (2020). https://doi.org/10.1007/s11664-020-08273-w

Download citation


  • Cu-cored solder joint
  • height effect
  • intermetallic compound (IMC)
  • mechanical property
  • fracture mode