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Room Temperature Bonding on Interface Between Metal and Ceramic

  • TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder
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Abstract

The influence of surface activated bonding (SAB) on adhesion strength between a metal and ceramic including Al/AlN and Cu/AlN is investigated. Plasma pre-treatments can significantly increase the adhesion strength between the metal and ceramic through surface activation, which can enlarge the contact area between metal and ceramic. Bonding pressure is also an important factor to improve the adhesion between metal and ceramic during SAB. Successful bonding between the metal and ceramic via SAB can be attributed to the formation of the interface layer where plastic deformation and rearrangement of metal to the ceramic occurs, which improves the atomic scale interconnection between the metal and ceramic. In this study, the influence of experimental SAB conditions for processing such as plasma power, degree of vacuum and bonding pressure on adhesion strength is investigated. Also, the thermal conduction of metal/ceramic laminates is discussed for its potential application as a heat spreader of LED chips.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Inha University, 25 Younghyun-Dong, Incheon, 405-751, Korea

    Kyu-Bong Jang & Soong-Keun Hyun

  2. Korea Institute of Industrial Technology, 113-58, Seohaean-ro, Siheung-si, Gyeonggi-do, 15014, Korea

    Kyu-Bong Jang, Sungwook Mhin, Sung-Chul Lim, Young-Sik Song, Keun-Hyo Lee, Soo-Keun Park &  Kyoung-Il Moon

  3. School of Aerospace and Mechanical Engineering, Korea Aerospace University, Goyangsi, Gyeonggido, 412-791, Korea

    Seung Hwan Lee

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  1. Kyu-Bong Jang
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  2. Sungwook Mhin
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  4. Young-Sik Song
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Correspondence to Sungwook Mhin.

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Jang, KB., Mhin, S., Lim, SC. et al. Room Temperature Bonding on Interface Between Metal and Ceramic. J. Electron. Mater. 48, 72–78 (2019). https://doi.org/10.1007/s11664-018-6693-8

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  • DOI: https://doi.org/10.1007/s11664-018-6693-8

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