Journal of Electronic Materials

, Volume 47, Issue 7, pp 4170–4176 | Cite as

Evolution of the Thermal Conductivity of Sintered Silver Joints with their Porosity Predicted by the Finite Element Analysis of Real 3D Microstructures

  • L. Signor
  • P. Kumar
  • B. Tressou
  • C. Nadot-Martin
  • José Miranda-Ordonez
  • J. Carr
  • K. Joulain
  • X. Milhet


Silver paste sintering is a very promising technology for chip bonding in future power electronics modules owing to its high melting temperature and the good electrical and thermal properties among other classic solder alloys. However, in its sintered form, these joints contain nanometric/submicrometric pores that affect their thermal performance. The present study gives insight into the relationship between the material thermal conductivity and the real three-dimensional porous structure using finite element modelling. It is shown that over a certain pore fraction threshold (∼ 13%), the pore morphology has a non-negligible influence on the thermal conductivity. Results are also compared to predictions obtained by analytical models available in the literature.


Silver sintering power electronics porosity effective thermal conductivity finite element modeling (computational homogenization) 


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Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  1. 1.Institut Pprime - UPR CNRS 3346ISAE-ENSMA – Université de PoitiersFuturoscope ChasseneuilFrance
  2. 2.École de Technologie SupÉrieureMontrealCanada
  3. 3.Henry Moseley X-ray Imaging FacilityThe University of ManchesterManchesterUK

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