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High-Temperature Capacitor Polymer Films

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Abstract

Film capacitor technology has been under development for over half a century to meet various applications such as direct-current link capacitors for transportation, converters/inverters for power electronics, controls for deep well drilling of oil and gas, direct energy weapons for military use, and high-frequency coupling circuitry. The biaxially oriented polypropylene film capacitor remains the state-of-the-art technology; however, it is not able to meet increasing demand for high-temperature (>125°C) applications. A number of dielectric materials capable of operating at high temperatures (>140°C) have attracted investigation, and their modifications are being pursued to achieve higher volumetric efficiency as well. This paper highlights the status of polymer dielectric film development and its feasibility for capacitor applications. High-temperature polymers such as polyetherimide (PEI), polyimide, and polyetheretherketone were the focus of our studies. PEI film was found to be the preferred choice for high-temperature film capacitor development due to its thermal stability, dielectric properties, and scalability.

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References

  1. F. Jacobs, PP for Film Capacitors: Origin, Manufacturing and Processing. www.borealisgroup.com.

  2. Q. Tan, P.C. Irwin, and Y. Cao, IEEJ Trans. Fundam. Mater. 126, 1209 (2006).

    Article  Google Scholar 

  3. S.M. Dirk, P.S. Sawyer, J. Wheeler, M. Stavig, and B. Tuttle, Proceedings of the-IEEE International Pulsed Power Conference (2009).

  4. S. Dirk, M. Denton, K. Cicotte, K. Johns, C. Belcher, and C. Fujimoto, DOE Project ID: APE009 by Sandia National Lab, (2013).

  5. J. Bond, Electronic Concept Inc. www.ECI.com.

  6. Q.M. Zhang, Strategic Polymers. (2011); http://strategicpolymers. squarespace.com/capacitors

  7. S.H. Zhang, C. Zou, X. Zhou, and D. Kushner, Proceedings of CARTS USA, 28–31 (2011); http://strategicpolymers.square space.com/ capacitors.

  8. C. Zou and Q.M. Zhang, S.H. Zhang, D. Kushner, X. Zhou, R. Bernard, and R.J. Orchard, Jr., J. Vac. Sci. Technol. B 29, (2011).

  9. R.G. Lorenzini, et al., Polymer 54, 3529 (2013).

    Article  Google Scholar 

  10. D.Q. Tan, DARPA IHEDC report, FA9451-08-C-0166, (2011).

  11. Amethyst Galleries’ Mineral Gallery, http://www.galleries. com/.

  12. TRS Technologies, http://www.trstechnologies.com/Products/ Specialty_Capacitors.

  13. Eclipse NanoMed, LLC, http://www.eclipsenanomed.com/.

  14. Q. Tan, P.C. Irwin, and Y. Cao, Advanced dielectrics for capacitors. IEEJ Trans. Fundam. Mater. 126, 1153–1159 (2006).

    Article  Google Scholar 

  15. J. Nelson, Hamilton Sundstrand, Brady Corporation, Steinerfilm, Inc., Dearborn Electronics, DOE Award No.: DE-FC26-06NT42949, US DOE/NETL/Office of Fossil Energy.

  16. P.D.A. Brather at University in Erlangen, http://www.cgtec. eu/wp-content/uploads/dielectric-properties-450G-GL30-vs-T-and-f-e.pdf.

  17. J. Ho and T. R. Jow, IEEE International Conference on Solid Dielectrics, Bologna, Italy, (2013).

  18. J.B. Ennis, GA-ESI Power Systems Department, private communication, (2008); www.steinerfilm.de.

  19. P. Irwin, R King, L Salasoo, D. Tan, Y. Cao, and N. Silvi, Advanced Capacitors World Summit 2009, La Jolla, CA, March 31–April 3, (2009). Personal communication with Mark Carter of Dearborn Electronics Inc. (2008).

  20. R.S. Taylor, N. Silvi, Q. Chen, and L.L. Zhang, DOE report DE-FC26-07NT43121 (2012).

  21. E. Tuncer, N. Silvi, G. Yeager, and P. Irwin, GE internal report, 2012. AFRL-SAIC Subcontract#P010020488 (2012).

  22. Q. Tan, P.C. Irwin, Y.Cao, S.H. Zhang, and L.D. Stevanovic, U.S. Patent 7,542,265B2, (2009).

  23. D. Q. Tan, G.T. Dalakos, Y. Cao, Q. Chen, and R.A. Zhao, U.S. Patent 8,354,166B2, (2013).

  24. M. Wolak, M. Pan, A. Wan, J. Shirk, M. Mackey, A. Hiltner, E. Baer, and L. Flandin, Appl. Phys. Lett. 92, 113301 (2008).

    Article  Google Scholar 

  25. Z. Zhou, J. Carr, M. Mackey, K. Yin, D. Schuele, L. Zhu, and E. Baer, J. Polym. Sci. B 51, 978–991 (2013).

    Article  Google Scholar 

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Acknowledgements

This material is based upon work supported by the Department of Energy under Award Number DE-EE0006433. The authors would like to acknowledge Colin McTigue for performing dielectric tests. Technical guidance and financial support from Scott Wright at GE-Unison business are greatly acknowledged.

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Correspondence to Daniel Tan.

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Tan, D., Zhang, L., Chen, Q. et al. High-Temperature Capacitor Polymer Films. J. Electron. Mater. 43, 4569–4575 (2014). https://doi.org/10.1007/s11664-014-3440-7

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  • DOI: https://doi.org/10.1007/s11664-014-3440-7

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