Microstructure and Properties of the Al-27Si/Cu/Al-50Si Joint Brazed by the Partial Transient Liquid Phase Bonding
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Al-27Si and Al-50Si were brazed by using a thin Cu interlayer. The metallurgical bonding without obvious defects is achieved, and a wide brazing seam consisting of fine eutectic structures and coarse Si particles is formed in the Al-27Si/Cu/Al-50Si joint. The deposition of Si element in the liquid phases during solidification results in the formation of the larger Si particles and ultra-small Si particles in the brazing seam. The shear strength of the joint reaches 63 MPa.
- 15.H.L. Lukas, N. Lebrun: Al-Cu-Si (Aluminium-Copper-Silicon), in: Ternary Alloys Systems–Phase Diagrams, Crystallographic and Thermodynamic Data, Light Metal Systems, Part 2: Selected Systems form Al-Cu-Fe to Al-Fe-Ti, G. Effenberg and S. Ilyenko (ed.), Springer, New York, 2005, pp. 135–147.Google Scholar