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Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag

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Abstract

The microstructure of the impact weld interface of pseudo single grained copper and silver is investigated. Electron backscattered diffraction shows severe plastic deformation at the weld interface and suggests that the cooling rate of the interface is fast enough to avoid conventional eutectic lamellar structure in localized melted zones. Scanning transmission electron microscopy, along with nano-diffraction and compositional analysis, demonstrates that impact welding can achieve metallurgical bonding in the solid-state without forming an amorphous structure.

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The authors gratefully acknowledge the financial support from the National Science Foundation (Grant Numbers CMMI-1538736 and CMMI-1531785).

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Authors and Affiliations

  1. Department of Materials Science and Engineering, The Ohio State University, Columbus, OH, 43210, USA

    Taeseon Lee, Menglin Zhu, Taylor Dittrich, Jinwoo Hwang, Anupam Vivek & Glenn S. Daehn

  2. Center for Electron Microscopy and Analysis, The Ohio State University, Columbus, OH, 43212, USA

    Menglin Zhu & Jinwoo Hwang

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  1. Taeseon Lee
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  2. Menglin Zhu
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  3. Taylor Dittrich
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  4. Jinwoo Hwang
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  6. Glenn S. Daehn
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Correspondence to Taeseon Lee.

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Manuscript submitted June 11, 2019.

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Lee, T., Zhu, M., Dittrich, T. et al. Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag. Metall Mater Trans A 51, 558–561 (2020). https://doi.org/10.1007/s11661-019-05557-7

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