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Experimental Mechanics

, Volume 57, Issue 4, pp 603–614 | Cite as

Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

  • M. Hasnine
  • J.C. Suhling
  • B.C. Prorok
  • M.J. Bozack
  • P. Lall
Article

Abstract

In this paper, the mechanical properties and creep behavior of lead-free solder joints has been characterized by nano-mechanical testing of single grain SAC305 solder joints extracted from plastic ball grid array (PBGA) assemblies. The anisotropic mechanical properties characterized include the elastic modulus, hardness, and yield stress. An approach is suggested to predict tensile creep strain rates for low stress levels using nanoindentation creep data measured at very high compressive stress levels. The uniaxial creep rate measured on similarly prepared bulk (large) specimens was found to be of the same order-of-magnitude as the creep rate observed in single-grain BGA joints, with chararacteristically (slightly) higher creep strains measured during nanoindentation. This suggests that the same creep mechanism operates in both size domains. Electron backscattered diffraction (EBSD) and nanoindentation testing further showed that the modulus, hardness, and creep properties of solder joints are highly dependent on the crystal orientation.

Keywords

Solder joints Creep Hardness Nanoindentation EBSD 

Supplementary material

11340_2017_258_MOESM1_ESM.pdf (820 kb)
ESM 1 (PDF 820 kb)

References

  1. 1.
    Ma H, Suhling JC (2009) A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci 44:1141–1158CrossRefGoogle Scholar
  2. 2.
    Lee BZ, Lee DN (1998) Spontaneous growth mechanism of tin whiskers. Acta Mater 46(10):3701–3714Google Scholar
  3. 3.
    Bieler TR, Jiang H, Lehman LP, Kirkpatrick T, Cotts EJ, Nandagopal B (2008) Influence of Sn grain size and orientation in the thermomechanical response and reliability of Pb-free solder joints. IEEE Transactions on Components and Packaging Technologies 31(2):370–381CrossRefGoogle Scholar
  4. 4.
    Jing HAN, Hongtao CHEN, Mingyu LI (2012) Role of grain orientation in the failure of Sn-based solder joints under thermo-mechanical fatigue. Acta Metall Sin 25(3):214–224Google Scholar
  5. 5.
    Goodall R, Clyne TW (2006) A critical appraisal of the extraction of creep parameters from nanoindentation data obtained at room temperature. Acta Mater 54:5489–5499CrossRefGoogle Scholar
  6. 6.
    Poisl WH, Oliver WC, Fabes BD (1995) The relationship between indentation and uniaxial creep in amorphous selenium. J Mater Res 10(8):2024–2032CrossRefGoogle Scholar
  7. 7.
    Lucas BN, Oliver WC (1999) Indentation power law creep of high purity indium. Metall Mater Trans A 30A:601CrossRefGoogle Scholar
  8. 8.
    Lee Y, Basaran C (2011) A creep model for solder alloys. Trans Of ASME, J of Electronic Packaging 133(4):044501–044501CrossRefGoogle Scholar
  9. 9.
    Zhang Y, Cai Z, Suhling JC, Lall P, Bozack MJ (2008) The effects of aging temperature on SAC solder joint material behavior and reliability. Proceedings of the 58th IEEE Electronic Components and Technology Conference, pp 99–112, Orlando, FLGoogle Scholar
  10. 10.
    Mustafa M, Cai Z, Suhling J, Lall P (2011) The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders. Proceedings of the 61st Electronic Components and Technology Conference, pp. 927–939, Orlando, FLGoogle Scholar
  11. 11.
    Motalab M, Cai Z, Suhling JC, Zhang J, Evans JL, Bozack MJ, Lall P (2012) Improved predictions of lead free solder joint reliability that include aging effects. Proceedings of 62nd Electronic Components and Technology Conference, pp. 513–531, San Diego, CAGoogle Scholar
  12. 12.
    Lall P, Shantaram S, Suhling J, Locker D (2013) Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 lead free alloys. Proceedings of the 63rd IEEE Electronic Components and Technology Conference, pp. 1277–1293, Las Vegas, NVGoogle Scholar
  13. 13.
    Pang JHL, Low TH, Xiong BS, Xu L, Neo CC (2004) Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength. Thin Solid Films 462-463:370–375CrossRefGoogle Scholar
  14. 14.
    Wiese S, Wolter KJ (2007) Creep of thermally aged SnAgCu solder joints. Microelectron Reliab 47:223–232CrossRefGoogle Scholar
  15. 15.
    Dutta I, Pan D, Marks RA, Jadhav SG (2005) Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders. Mater Sci Eng A 410-411:48–52CrossRefGoogle Scholar
  16. 16.
    Fischer-Cripps AC (2011) Nanoindentation, Third edn. Springer, New YorkCrossRefGoogle Scholar
  17. 17.
    Chromik RR, Vinci RP, Allen SL, Notis MR (2003) Measuring the mechanical properties of lead free solder and Sn-based intermetallics by nanoindentation. J Meteorol 55:66–69Google Scholar
  18. 18.
    Deng X, Chawla N, Chawla KK, Koopman M (2004) Deformation Behavior of (Cu,Ag)-Sn Intemetallics by Nanoindentation. Acta Mater 52:4291–4303CrossRefGoogle Scholar
  19. 19.
    Deng X, Chawla N, Chawla KK, Koopman M (2004) Young Modulus of (Cu,Ag)-Sn Intemetallics by Nanoindentation. Mater Sci Eng A 364:240–243CrossRefGoogle Scholar
  20. 20.
    Takemoto T, Qu J (2009) Mechanical properties versus temperature relation of individual phase in Sn-3.0Ag-0.5Cu lead free solder alloy. Microelectron Reliab 49:296–302CrossRefGoogle Scholar
  21. 21.
    Han YD, Jing HY, Nai SML, Xu LY, Tan CM, Wei J (2010) Temperature dependence of creep and hardness of Sn-Ag-Cu lead free solders. J Electron Mater 39(2):223–229CrossRefGoogle Scholar
  22. 22.
    Xu L, Pang JHL (2006) Nanoindentation characterization of Ni-Cu-Sn IMC layer subjected to isothermal aging. Thin Solid Films 504:362–366CrossRefGoogle Scholar
  23. 23.
    Venkatadri V, Yin L, Xing Y, Cotts E, Srihari K, Borgesen P (2009) Accelerating the effects of aging on reliability of lead free solder joints in a quantitative fashion. Proceedings of the IEEE Electronic Components and Technology Conference, pp. 398–405Google Scholar
  24. 24.
    Basaran, C. and Jiang, J.,"Measuring Intrinsic Elastic Modulus of Pb/Sn Solder Alloys," Mech Mater, 34, 349–362, 2002.Google Scholar
  25. 25.
    Gomez J, Basaran C (2006) Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results. Int J Solids Struct 43:1505–1527CrossRefMATHGoogle Scholar
  26. 26.
    Hasnine Md, Mustafa M, Suhling JC, Prorok BC, Bozack MJ, Lall P (2014) Nanomechanical characterization of lead free solder joints. In: MEMS and Nanotechnology, Volume 5, pp. 11–22. Springer International PublishingGoogle Scholar
  27. 27.
    Hasnine Md, Suhling JC, Prorok BC, Bozack MJ, Lall P (2014) Nanomechanical characterization of SAC305 solder joints-effects of aging. In: Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE Intersociety Conference on, pp. 152–160Google Scholar
  28. 28.
    Henshall G (2009) iNEMI lead-free alloy alternatives project report: thermal fatigue experiments and alloy test requirements. Proceedings of the SMTAI, pp. 317–324Google Scholar
  29. 29.
    Hay J, Agee P, Herbert E (2010) Continuous stiffness measurement during instrumented indentation testing. Exp Tech 34(3):86–94CrossRefGoogle Scholar
  30. 30.
    Oliver WC, Pharr GM (1992) An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J Mater Res 7(6):1564–1583CrossRefGoogle Scholar
  31. 31.
    Tabor D (1951) Hardness of metals. Oxford University Press, OxfordGoogle Scholar
  32. 32.
    Chhanda N, Suhling JC, Lall P (2011) Experimental characterization and viscoplastic modeling of the temperature dependent material behavior of underfill encapsulants. Proceedings of InterPACK 2011, ASME, Paper No. IPACK2011–52209, pp. 1–13Google Scholar
  33. 33.
    Mayo MJ, Nix WD (1988) A Micro-Indentation Study of Superplasticity in Pb,Sn and Sn-38 wt% Pb. Acta Mater 36(8):2183–2192CrossRefGoogle Scholar
  34. 34.
    Garofalo F (1963) An empirical relation defining the stress dependence of minimum creep rate in metals. Trans Metall Soc AIME 227:351–355Google Scholar
  35. 35.
    Frost HJ, Ashby MF Deformation Mechanism Maps: The Plasticity and Creep of Metals and Ceramics. Pergamon Press, OxfordGoogle Scholar

Copyright information

© Society for Experimental Mechanics 2017

Authors and Affiliations

  • M. Hasnine
    • 1
  • J.C. Suhling
    • 1
  • B.C. Prorok
    • 1
  • M.J. Bozack
    • 1
  • P. Lall
    • 1
  1. 1.Department of Mechanical EngineeringAuburn UniversityAuburnUSA

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