Experimental Mechanics

, Volume 57, Issue 4, pp 603–614 | Cite as

Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

  • M. Hasnine
  • J.C. Suhling
  • B.C. Prorok
  • M.J. Bozack
  • P. Lall


In this paper, the mechanical properties and creep behavior of lead-free solder joints has been characterized by nano-mechanical testing of single grain SAC305 solder joints extracted from plastic ball grid array (PBGA) assemblies. The anisotropic mechanical properties characterized include the elastic modulus, hardness, and yield stress. An approach is suggested to predict tensile creep strain rates for low stress levels using nanoindentation creep data measured at very high compressive stress levels. The uniaxial creep rate measured on similarly prepared bulk (large) specimens was found to be of the same order-of-magnitude as the creep rate observed in single-grain BGA joints, with chararacteristically (slightly) higher creep strains measured during nanoindentation. This suggests that the same creep mechanism operates in both size domains. Electron backscattered diffraction (EBSD) and nanoindentation testing further showed that the modulus, hardness, and creep properties of solder joints are highly dependent on the crystal orientation.


Solder joints Creep Hardness Nanoindentation EBSD 

Supplementary material

11340_2017_258_MOESM1_ESM.pdf (820 kb)
ESM 1 (PDF 820 kb)


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Copyright information

© Society for Experimental Mechanics 2017

Authors and Affiliations

  • M. Hasnine
    • 1
  • J.C. Suhling
    • 1
  • B.C. Prorok
    • 1
  • M.J. Bozack
    • 1
  • P. Lall
    • 1
  1. 1.Department of Mechanical EngineeringAuburn UniversityAuburnUSA

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