Strength of Materials

, Volume 50, Issue 1, pp 92–97 | Cite as

Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation

  • C. P. Wang
  • J. K. Fan
  • F. G. Li
  • J. C. Liu
Article
  • 3 Downloads

Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate that both high-angle grain boundaries and misorientation increase with strain. The grains finer and more homogeneous. In addition, the microstructure within the shear band demonstrates a distinct preferred orientation. The crystal <110> direction is parallel to the shear direction, and the crystal {111} inclines to the plane shear surface. A torsion-induced bar specimen includes a {011} <211> brass texture, {011} <100> Gaussian texture, and stronger {112} <111> copper texture.

Keywords

severe plastic deformation copper torsion microstructure texture 

Notes

Acknowledgments

This work was partially supported by National Natural Science Foundation of China (No. 51275414, No. 51172161, No. 51405136, and No. 51505191), School Youth Foundation (No. 1205-04020202), the fund of the State Key Laboratory of Solidification Processing in NWPU (No. SKLSP201517), and Doctor Foundation of Henan Polytechnic University (No. B2015-37).

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • C. P. Wang
    • 1
  • J. K. Fan
    • 2
  • F. G. Li
    • 3
  • J. C. Liu
    • 1
  1. 1.School of Materials Science and EngineeringTianjin Polytechnic UniversityTianjinChina
  2. 2.School of Mechanical and Power EngineeringHenan Polytechnic UniversityJiaozuoChina
  3. 3.School of Materials Science and EngineeringNorthwestern Polytechnical UniversityXi’anChina

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