Strength of Materials

, Volume 50, Issue 1, pp 92–97 | Cite as

Electron Backscatter Diffraction Analysis of the Microstructure Fineness in Pure Copper Under Torsional Deformation

  • C. P. Wang
  • J. K. Fan
  • F. G. Li
  • J. C. Liu

Torsional deformation is regarded a promising deformation procedure to prepare the gradient structural materials. Pure copper was subjected to large plastic strains in torsion. Electron backscatter diffraction analysis was used to explore the microstructure evolution. The observations demonstrate that both high-angle grain boundaries and misorientation increase with strain. The grains finer and more homogeneous. In addition, the microstructure within the shear band demonstrates a distinct preferred orientation. The crystal <110> direction is parallel to the shear direction, and the crystal {111} inclines to the plane shear surface. A torsion-induced bar specimen includes a {011} <211> brass texture, {011} <100> Gaussian texture, and stronger {112} <111> copper texture.


severe plastic deformation copper torsion microstructure texture 



This work was partially supported by National Natural Science Foundation of China (No. 51275414, No. 51172161, No. 51405136, and No. 51505191), School Youth Foundation (No. 1205-04020202), the fund of the State Key Laboratory of Solidification Processing in NWPU (No. SKLSP201517), and Doctor Foundation of Henan Polytechnic University (No. B2015-37).


  1. 1.
    T. H. Fang, W. L. Li, N. R. Tao, and K. Lu, “Revealing extraordinary intrinsic tensile plasticity in gradient nano-grained copper,” Science, 331, No. 6024, 1587–1590 (2011).Google Scholar
  2. 2.
    J. Wang, D. Zhang, Y. Li, et al., “Effect of initial orientation on the microstructure and mechanical properties of textured AZ31 Mg alloy during torsion and annealing,” Mater. Design, 86, 526–535 (2015).Google Scholar
  3. 3.
    N. Guo, B. Song, H. Yu, et al., “Enhancing tensile strength of Cu by introducing gradient microstructures via a simple torsional deformation,” Mater. Design, 90, 545– 550 (2016).CrossRefGoogle Scholar
  4. 4.
    C. Wang, F. G. Li, J. Li, et al., “Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsional deformation,” Mater. Sci. Eng. A, 598, 7–14 (2014).CrossRefGoogle Scholar
  5. 5.
    J. H. Li, F. G. Li, M. Z. Hussain, et al., “Micro-structural evolution subjected to combined tension–torsional deformation for pure copper,” Mater. Sci. Eng. A, 610, 181–187 (2014).CrossRefGoogle Scholar
  6. 6.
    B. Song, N. Guo, R. Xin, et al., “Strengthening and toughening of extruded magnesium alloy rods by combining pre-torsional deformation with subsequent annealing,” Mater. Sci. Eng. A, 650, 300–304 (2016).CrossRefGoogle Scholar
  7. 7.
    C. P. Wang, F. G. Li, L. Wei, et al., “Experimental microindentation of pure copper subjected to severe plastic deformation by combined tension–torsion,” Mater. Sci. Eng. A, 571, 95–102 (2013).CrossRefGoogle Scholar
  8. 8.
    A. Nadai, Theory of Flow and Fracture of Solids, McGraw-Hill, New York (1950).Google Scholar
  9. 9.
    J. Chakrabarty, Theory of Plasticity, Butterworth-Heinemann, Oxford (2006).Google Scholar
  10. 10.
    Y. Estrin, L. S. Tóth, A. Molinari, and Y. Bréchet, “A dislocation-based model for all hardening stages in large strain deformation,” Acta Mater., 46, No. 15, 5509–5522 (1998).CrossRefGoogle Scholar
  11. 11.
    N. A. Fleck, H. M. Muller, M. F. Ashby, and J. W. Hutchinson, “Strain gradient plasticity: theory and experiment,” Acta Metall. Mater., 42, No. 2, 475–487 (1994).CrossRefGoogle Scholar
  12. 12.
    A. Bhattacharyya, D. Rittel, and G. Ravichandran, “Effect of strain rate on deformation texture in OFHC copper,” Scripta Mater., 52, No. 7, 657–661 (2005).CrossRefGoogle Scholar
  13. 13.
    S. Khamsuk, N. Park, H. Adachi, et al., “Evolution of ultrafine microstructures in commercial purity aluminum heavily deformed by torsion,” J. Mater. Sci., 47, No. 22, 7841–7847 (2012).Google Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • C. P. Wang
    • 1
  • J. K. Fan
    • 2
  • F. G. Li
    • 3
  • J. C. Liu
    • 1
  1. 1.School of Materials Science and EngineeringTianjin Polytechnic UniversityTianjinChina
  2. 2.School of Mechanical and Power EngineeringHenan Polytechnic UniversityJiaozuoChina
  3. 3.School of Materials Science and EngineeringNorthwestern Polytechnical UniversityXi’anChina

Personalised recommendations