Electrodeposition of SnSbCu Alloy on Copper from an Electrolyte with Varied Content of Antimony Chloride
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The microstructure and chemical composition of electrodeposited alloys of the SnSbCu system with varied concentration of antimony chloride in the electrolyte have been investigated. It is shown that during electrodeposition mechanical-mixture alloys are not formed, but rather intermetallic compounds. It is found that increasing the concentration of antimony chloride in the electrolyte leads to a decrease in the tin content and cracking of the coating.
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