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Photoelectrochemical properties of copper oxide (CuO) influenced by work functions of conductive electrodes

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Abstract

Copper (II) oxide (CuO) is a promising p-type semiconductor for water splitting to produce hydrogen under visible-light irradiation. The CuO photoelectrode was successfully fabricated on several conductive supports by an assist of electrochemical deposition methods. The electronic structures of CuO electrodes were characterized by FE-SEM, XRD, UV–Vis, Raman, electrochemical impedance spectroscopy, as well as photoelectrochemical properties. Cathodic photocurrent was observed on the CuO electrodes in 0.5 M Na2SO4 aqueous solution under AM1.5G solar irradiation. It was also found that the photocurrent densities significantly increased as an increase in work functions of conductive supports: carbon < FTO < gold < nickel < platinum plates. It was clearly demonstrated that Ohmic junction between CuO and conductive supports with large work function plays a significant role in the effective charge separations of holes and electrons.

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Authors and Affiliations

  1. College of Engineering, Osaka Institute of Technology, 5-16-1 Omiya, Asahi-ku, Osaka, 535-8585, Japan

    Ryouhei Tomita & Shinya Higashimoto

  2. Department of Applied Chemistry, Graduate School of Engineering, Osaka Prefecture University, 1-2 Gakuencho, Nakaku, Sakai, Osaka, 599-8570, Japan

    Zhengyu Pu & Takashi Kamegawa

  3. NanoSquare Research Institute, Osaka Prefecture University, 1-2 Gakuencho, Nakaku, Sakai, Osaka, 599-8570, Japan

    Takashi Kamegawa

  4. State Key Laboratory of Photocatalysis on Energy and Environment, College of Chemistry, Fuzhou University, Fuzhou, 350002, Fujian, China

    Masakazu Anpo

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  1. Ryouhei Tomita
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  2. Zhengyu Pu
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  4. Masakazu Anpo
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  5. Shinya Higashimoto
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Correspondence to Shinya Higashimoto.

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This manuscript is dedicated to the late Prof Michel Che.

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Tomita, R., Pu, Z., Kamegawa, T. et al. Photoelectrochemical properties of copper oxide (CuO) influenced by work functions of conductive electrodes. Res Chem Intermed 45, 5947–5958 (2019). https://doi.org/10.1007/s11164-019-04012-x

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