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Optical and Quantum Electronics

, Volume 38, Issue 8, pp 675–682 | Cite as

Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules

Article

Abstract

Scattering parameters of photodiode chip, TO header and TO packaged module are measured, and the effects of TO packaging network on the high-frequency response of photodiode are investigated. Based on the analysis, the potential bandwidth of TO packaging techniques is estimated from the scattering parameters of the TO packaging network. Another method for estimating the potential bandwidth from the equivalent circuit for the TO packaged photodiode model is also presented. The results obtained using both methods show that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 GHz.

Keywords

packaging photodiode photodiode module scattering parameters measurement 

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Copyright information

© Springer Science+Business Media, LLC 2006

Authors and Affiliations

  1. 1.State Key Laboratory on Integrated OptoelectronicsInstitute of Semiconductors, Chinese Academy of SciencesBejingPR China

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