The effect of aging at room temperature after equal-channel angular pressing and annealing on parameters of the low-temperature relaxation peak and dynamic Young’s modulus in nanostructured copper is studied. The dislocation nature of the peak is established. It is shown that the high rate of change for all peak parameters is observed close to the copper static relaxation temperature. The data obtained are in good agreement with results of high-temperature in situ changes of elasticity modulus and microhardness.
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Translated from Metallovedenie i Termicheskaya Obrabotka Metallov, No. 5, pp. 28 – 32, May, 2012.
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Pal’-Val’, P.P., Pal’-Val’, L.N. Low-temperature internal friction and nanostructured metal stability. Met Sci Heat Treat 54, 234–238 (2012). https://doi.org/10.1007/s11041-012-9488-1
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DOI: https://doi.org/10.1007/s11041-012-9488-1