Abstract
Microstructure, melting behavior and thermal conductivities of three Bi–Ag alloys with 5, 20 and 45 mass% of Ag were experimentally studied in the present work. Phase morphology of the alloys was analyzed by the light microscopy and scanning electron microscopy with energy-dispersive X-ray spectrometry. Phase transition temperatures and their heat effects were measured using differential scanning calorimetry (DSC). The calculation of phase diagrams method was used for the computation of thermodynamic functions such as enthalpy and specific heat capacity of the investigated alloys. Experimentally obtained DSC heating scans were compared with the simulated DSC scans derived from thermodynamic data, and good mutual agreement was noticed. The flash method was used for determination of thermal diffusivity and thermal conductivity of the investigated alloys. It was found that increase in silver content to 45 mass% resulted in modest increase in thermal conductivity of the investigated alloys. Thermal conductivities for all three investigated eutectic alloys slightly decrease with increasing temperature.
Similar content being viewed by others
References
Spinelli JE, Luiz Silva B, Garcia A. Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications. Mater Des. 2014;58:482–90. https://doi.org/10.1016/j.matdes.2014.02.026.
Song JM, Chuang HY, Wen TX. Thermal and tensile properties of Bi–Ag alloys. Metall Mater Trans A. 2007;38:1371–5. https://doi.org/10.1007/s11661-007-9138-1.
Lalena JN, Dean NF, Weiser MW. Experimental investigation of Ge-doped Bi–11Ag as a new Pb-free solder alloy for power die attachment. J Electron Mater. 2002;31:1244–9. https://doi.org/10.1007/s11664-002-0016-8.
Reti A. Silver: alloying, properties, and applications. In: Encyclopedia of materials: science and technology. Amsterdam: Elsevier; 2001. p. 8618–21. https://doi.org/10.1016/B0-08-043152-6/01536-9.
Kroupa A, Dinsdale AT, Watson A, Vrestal J, Vízdal J, Zemanova A. The development of the COST 531 lead-free solders thermodynamic database. JOM. 2007;59:20–5. https://doi.org/10.1007/s11837-007-0084-6.
Kim JH, Jeong SW, Lee HM. Thermodynamics-aided alloy design and evaluation of Pb-free solders for high-temperature applications. Mater Trans. 2002;43:1873–8.
Parker WJ, Jenkins RJ, Butler CP, Abbott GL. Flash method of determining thermal diffusivity, heat capacity, and thermal conductivity. J Appl Phys. 1961;32:1679–84. https://doi.org/10.1063/1.1728417.
Taylor MR, Fidler RS, Smith RW. Broken lamellar eutectic growth; structure of the silver-bismuth eutectic. J Cryst Growth. 1968;3:666–73. https://doi.org/10.1016/0022-0248(68)90242-X.
Boettinger WJ, Kattner UR, Moon KW, Perepezko JH. DTA and heat-flux DSC measurements of alloy melting and freezing. In: Zhao JC, editor. Methods for phase diagram determination. Amsterdam: Elsevier Science; 2007. p. 151–221.
Boettinger WJ, Kattner UR. On differential thermal analyzer curves for the melting and freezing of alloys. Metall Mater Trans A. 2002;33:1779–94. https://doi.org/10.1007/s11661-002-0187-1.
Lukas HL, Fries SG, Sundman B. Computationalthermodynamics: theCalphadmethod. Cambridge: CambridgeUniversityPress; 2007.
Dinsdale AT. SGTEdataforpureelements. Calphad. 1991;15:317–425. https://doi.org/10.1016/0364-5916(91)90030-N.
Touloukian YS, Powell RW, Ho CY, Klemens PG. Thermal conductivity of metallic elements and alloys, vol. 1. IFI/Plenum: Washington, New York; 1970.
Kövér M, Behúlová M, Drienovský M, Motyčka P. Determination of the specific heat using laser flash apparatus. J Therm Anal Calorim. 2015;122:151–6. https://doi.org/10.1007/s10973-015-4748-0.
Huang L, Liu S, Du Y, Zhang C. Thermal conductivity of the Mg–Al–Zn alloys: experimental measurement and CALPHAD modeling. Calphad. 2018;62:99–108. https://doi.org/10.1016/j.calphad.2018.05.011.
Gaal PS, Thermitus MA, Stroe DE. Thermal conductivity measurements using the flash method. J Therm Anal Calorim. 2004;78:185–9. https://doi.org/10.1023/B:JTAN.0000042166.64587.33.
Wu JK, Lin KL, Salam B. Specific heat capacities of Sn–Zn-based solders and Sn–Ag–Cu solders measured using differential scanning calorimetry. J Electron Mater. 2009;38:227–30. https://doi.org/10.1007/s11664-008-0589-y.
Acknowledgements
The research presented in this paper was done with the financial support of the Ministry of Education, Science and Technological Development of the Republic of Serbia, within the funding of the scientific research work at the University of Belgrade, Technical Faculty in Bor, according to the contract with registration number 451-03-68/2020-14/ 200131.
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Manasijević, D., Balanović, L., Marković, I. et al. Microstructure and thermal properties of the Bi–Ag alloys. J Therm Anal Calorim 147, 1965–1972 (2022). https://doi.org/10.1007/s10973-020-10482-8
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10973-020-10482-8