Journal of Thermal Analysis and Calorimetry

, Volume 99, Issue 2, pp 495–500 | Cite as

In-plane thermal conductance measurement of one-dimensional nanostructures

  • Hsiao-Fang Lee
  • Benedict A. Samuel
  • M. A. Haque


We present a new analytical model for thermal conductivity measurement of one-dimensional nanostructures on substrates. The model expands the capability of the conventional 3ω technique, to make it versatile with both in and out of plane thermal conductivity measurement on specimens either freestanding or attached to substrates. We demonstrate the model on both conducting (aluminum) and semi-conducting (focused ion beam deposited platinum) specimens. The agreement with the established values in the literature suggests the superiority of this technique in terms of convenience and robustness of measurement.


3ω technique Thermal conductivity FIB Pt nanowire 



The authors gratefully acknowledge the Korea Institute of Metals and Machinery and the National Science Foundation, USA (ECS #0545683).


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Copyright information

© Akadémiai Kiadó, Budapest, Hungary 2009

Authors and Affiliations

  • Hsiao-Fang Lee
    • 1
  • Benedict A. Samuel
    • 1
  • M. A. Haque
    • 1
  1. 1.Department of Mechanical and Nuclear EngineeringThe Pennsylvania State UniversityUniversity ParkPAUSA

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