Journal of Engineering Physics and Thermophysics

, Volume 86, Issue 5, pp 1060–1065 | Cite as

Optimization of the required temperature of contact soldering of electronic devices


This paper presents the results of a complex of experimental and theoretical studies aimed at improving the quality of soldering electronic devices by optimizing the design-technological parameters.


engineering physics devices soldering temperature heat conduction time 


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  1. 1.
    N. F. Lashko and S. V. Lashko, Soldering of Metals [in Russian], 2nd edn., Mashinostroenie, Moscow (1967).Google Scholar
  2. 2.
    V. N. Skokov and V. D. Seleznev, Introduction to the Physics of Nonequilibrium Processes [in Russian], Izd. Ural’sk. Gos. Tekh. Univ. — Ural’sk. Politekh. Inst., Ekaterinburg (2010).Google Scholar
  3. 3.
    A. V. Luikov, Heat and Mass Transfer: Handbook [in Russian], 2nd edn., Énergiya, Moscow (1978).Google Scholar
  4. 4.
    S. A. Zhdanok, O. G. Penyazkov, and N. A. Fomin, Development of R. I. Soloukhin’s scientific line of investigations at the Heat and Mass Transfer Institute, Inzh.-Fiz. Zh., 83, No. 6, 1041–1057 (2010).Google Scholar
  5. 5.
    V. N. Shtennikov, International IPC standards for soldering steel rods, Nano- Mikrosist. Tekh., No. 10, 28–29 (2009).Google Scholar
  6. 6.
    V. N. Shtennikov, Some characteristic features of contact and laser soldering, Pribory, No. 2, 61–63 (2010).Google Scholar
  7. 7.
    A. I. Pekhovich and V. M. Zhidkikh, Calculations of the Thermal Regime of Solid Bodies [in Russian], Énergiya, Leningrad (1976).Google Scholar
  8. 8.
    Thermal Diffusivity of Certain Materials. Reference information.

Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.B. N. Yeltsin Ural Federal UniversityEkaterinburgRussia

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