Optimization of the required temperature of contact soldering of electronic devices
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This paper presents the results of a complex of experimental and theoretical studies aimed at improving the quality of soldering electronic devices by optimizing the design-technological parameters.
Keywordsengineering physics devices soldering temperature heat conduction time
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- 1.N. F. Lashko and S. V. Lashko, Soldering of Metals [in Russian], 2nd edn., Mashinostroenie, Moscow (1967).Google Scholar
- 2.V. N. Skokov and V. D. Seleznev, Introduction to the Physics of Nonequilibrium Processes [in Russian], Izd. Ural’sk. Gos. Tekh. Univ. — Ural’sk. Politekh. Inst., Ekaterinburg (2010).Google Scholar
- 3.A. V. Luikov, Heat and Mass Transfer: Handbook [in Russian], 2nd edn., Énergiya, Moscow (1978).Google Scholar
- 4.S. A. Zhdanok, O. G. Penyazkov, and N. A. Fomin, Development of R. I. Soloukhin’s scientific line of investigations at the Heat and Mass Transfer Institute, Inzh.-Fiz. Zh., 83, No. 6, 1041–1057 (2010).Google Scholar
- 5.V. N. Shtennikov, International IPC standards for soldering steel rods, Nano- Mikrosist. Tekh., No. 10, 28–29 (2009).Google Scholar
- 6.V. N. Shtennikov, Some characteristic features of contact and laser soldering, Pribory, No. 2, 61–63 (2010).Google Scholar
- 7.A. I. Pekhovich and V. M. Zhidkikh, Calculations of the Thermal Regime of Solid Bodies [in Russian], Énergiya, Leningrad (1976).Google Scholar
- 8.Thermal Diffusivity of Certain Materials. Reference information. http://temperatures.ru/pages/temperaturoprovodnost_nekotorykh_materialov
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