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Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

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Journal of Engineering Physics and Thermophysics Aims and scope

Abstract

Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

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Authors and Affiliations

  1. Tomsk State University of Control Systems and Radio Electronics, 40 Lenin Ave., Tomsk, 634045, Russia

    G. V. Kuznetsov & E. V. Kravchenko

Authors
  1. G. V. Kuznetsov
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  2. E. V. Kravchenko
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Correspondence to G. V. Kuznetsov.

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Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 80, No. 5, pp. 188–191, September–October, 2007.

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Kuznetsov, G.V., Kravchenko, E.V. Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment. J Eng Phys Thermophy 80, 1050–1054 (2007). https://doi.org/10.1007/s10891-007-0137-2

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  • DOI: https://doi.org/10.1007/s10891-007-0137-2

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