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Journal of Engineering Physics and Thermophysics

, Volume 80, Issue 5, pp 1050–1054 | Cite as

Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

  • G. V. Kuznetsov
  • E. V. Kravchenko
Article

Abstract

Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

Keywords

Heat Transfer Coefficient Emissivity Polymer Material Reliability Index Thermophysical Characteristic 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, Inc. 2007

Authors and Affiliations

  1. 1.Tomsk State University of Control Systems and Radio ElectronicsTomskRussia

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