Skip to main content
SpringerLink
Log in

Electrochemical migration behavior of low-temperature-sintered Ag nanoparticle paste using water-drop method

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The electrochemical migration (ECM) behavior of low-temperature-sintered Ag nanoparticle paste electrode was investigated using water-drop method. The effects of applied direct current bias voltage and NaCl concentration on ECM behavior were discussed. Results show that: at low NaCl concentration levels, mean time to failure caused by ECM decreased with increasing NaCl concentration due to the increase of solution conductivity; at medium NaCl concentration levels, dendrite growth was retarded due to the formation of AgOH or other insoluble products, while at high NaCl concentration levels, due to the turbulent hydrogen evolution, the second spreading of water drop resulted in the circuit broken and thus inhibited ECM behavior. Moreover, mean time to failure decreased with the rising applied bias voltage. More importantly, hexadecyltrimethylammonium chloride (CTAC) was proved to act as an effective inhibitor to migrate dendrite growth by selected adsorption. And the ECM inhibition efficiency increased with the concentration of CTAC. Relevant mechanisms of ECM behavior and ECM inhibition effect of CTAC for low-temperature-sintered Ag nanoparticle paste were proposed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. H. Lim, S. Kim, J. Lim, S. Park, Low Temperature-cured Electrically Conductive Pastes for Interconnection on Electronic Devices. J. Mater. Chem. 22, 20529–20534 (2012)

    Article  CAS  Google Scholar 

  2. L. Nayak, S. Mohanty, S. Nayak, A. Ramadoss, A Review on Inkjet Printing of Nanoparticle Ink for Flexible Electronics. J. Mater. Chem. 7, 8771–8795 (2019)

    Article  CAS  Google Scholar 

  3. W. Henry, E. George, Electrically Conducting Cements Containing Epoxy Resins and Silver. U.S. Patent. No. 2774747. (1956).

  4. J. Kang, J. Tok, Z. Bao, Self-healing Soft Electronics. Nat. Electron. 2, 144–150 (2019)

    Google Scholar 

  5. A. Desireddy, B. Conn, J. Guo, B. Yoon, R. Barnett, B. Monahan, K. Kirschbaum, W. Griffith, R. Whetten, U. Landman, T. Bigioni, Ultrastable Silver Nanoparticles. Nature 501, 399–402 (2013)

    Article  CAS  Google Scholar 

  6. R. Naik, S. Stringer, G. Agarwal, S. Jones, M. Stone, Biomimetic Synthesis and Patterning of Silver Nanoparticles. Nat. Mater. 1, 169–172 (2002)

    Article  CAS  Google Scholar 

  7. K. Kim, Y. Kwon, Y. Cho, S. Jung, Electrochemical Migration of Ag Nanoink Patterns Controlled by Atmospheric-pressure Plasma. Microelectronic. Eng. 106, 27–32 (2013)

    Article  CAS  Google Scholar 

  8. X. Zhong, W. Lu, B. Liao, B. Medgyes, J. Hu, Y. Zheng, D. Zeng, Z. Zhang, Evidence for Ag Participating the Electrochemical Migration of 96.5Sn-3Ag-0.5Cu Alloy. Corros. Sci. 156, 10–15 (2019)

    Article  CAS  Google Scholar 

  9. G. Kohman, H. Hermance, G. Downes, Silver Migration in Electrical Insulation. The Bell System Technical Journal. 34, 1115–1147 (1955)

    Article  CAS  Google Scholar 

  10. B. Liao, H. Wang, W. Xiao, Y. Cai, X. Guo, Recent Advances in Method of Suppressing Dendrite Formation of Tin-based Solder Alloys. J. Mater. Sci-Mater. El. 31, 13001–13010 (2020)

    Article  CAS  Google Scholar 

  11. B. Liao, H. Wang, S. Wan, W. Xiao, X. Guo, Electrochemical Migration Inhibition of Tin by Disodium Hydrogen Phosphate in Water Drop Test. Metals. 10, 942 (2020)

    Article  CAS  Google Scholar 

  12. X. Zhong, In Situ Study of the Electrochemical Migration of Tin in the Presence of H2S. J. Mater. Sci-Mater. El. 31, 8996–9005 (2020)

    Article  CAS  Google Scholar 

  13. P. Yi, C. Dong, Y. Ji, Y. Yin, J. Yao, K. Xiao, Electrochemical Migration Failure Mechanism and Dendrite Composition Characteristics of Sn96.5Ag3.0Cu0.5 Alloy in Thin Electrolyte Films. J. Mater. Sci-Mater. El. 30, 6575–6582 (2019)

    Article  CAS  Google Scholar 

  14. Y. Zhou, L. Yang, Y. Li, W. Lu, (2019) Exploring the Data-Driven Modeling Methods for Electrochemical Migration Failure of Printed Circuit Board. 2019 Prognostics and System Health Management Conference (PHM-Paris). IEEE, 100–105

  15. X. Zhong, L. Chen, B. Medgyes, Z. Zhang, S. Gao, L. Jakab, Electrochemical migration of Sn and Sn Solder Alloys: A Review. RSC. Adv. 7, 28186–28206 (2017)

    Article  CAS  Google Scholar 

  16. Y. Zhou, Y. Li, Y. Chen, M. Zhu, Life Model of the Electrochemical Migration Failure of Printed Circuit Boards Under NaCl Solution. IEEE T. Device Mater. Re. 19, 622–629 (2019)

    Article  CAS  Google Scholar 

  17. X. Qi, H. Ma, C. Wang, S. Shang, X. Li, Y. Wang, H. Ma, Electrochemical Migration Behavior of Sn-based Lead-free Solder. J. Mater. Sci-Mater. El. 30, 14695–14702 (2019)

    Article  CAS  Google Scholar 

  18. X. Li, X. Tian, S. Liu, C. Wu, Y. Han, L. Meng, L. Song, Y. Zhang, Self-assembled Vertically Aligned Silver Nanorod Arrays Prepared by Evaporation-induced Method as High-performance SERS Substrates. J. Mater. Sci. 55, 14019–14030 (2020)

    Article  CAS  Google Scholar 

  19. C. Pignolet, M. Euvrard, A. Foissy, C. Filiatre, Electrodeposition of Latex Particles in Presence of Surfactant: Investigation of Deposit Morphology. J. Colloid. Interf. Sci. 349, 41–48 (2010)

    Article  CAS  Google Scholar 

  20. J. Lin, Q. Liu, J. Zhang, Y. Wu, H. Li, Y. Ma, C. Qu, G. Chen, W. Song, Corrosion Inhibition and Structure-efficiency Relationship Study of CTAC and CDHAC. Desalin. Water. Treat. 139, 1–6 (2019)

    Article  CAS  Google Scholar 

  21. X. Zhong, S. Yu, L. Chen, J. Hu, Z. Zhang, Test Methods for Electrochemical Migration: A Review. J. Mater. Sci-Mater. El. 28, 2279–2289 (2017)

    Article  CAS  Google Scholar 

  22. W. Lin, C. Tsou, F. Ouyang, Electrochemical Migration of Nano-sized Ag Interconnects under Deionized Water and Cl−-containing Electrolyte. J. Mater. Sci-Mater. El. 29, 18331–18342 (2018)

    Article  CAS  Google Scholar 

  23. R. Manepalli, F. Stepniak, S. Bidstrup-Allen, P. Kohl, Silver Metallization for Advanced Interconnects. IEEE T. Adv. Packaging. 22, 4–8 (1999)

    Article  CAS  Google Scholar 

  24. G. Lu, C. Yan, Y. Mei, X. Li, Dependence of Electrochemical Migration of Sintered Nanosilver on Chloride. Mate. Chem. Phys. 151, 18–21 (2015)

    Article  CAS  Google Scholar 

  25. A. Zelyanskii, L. Zhukova, G. Kitaev, Solubility of AgCl and AgBr in HCl and HBr. Inorg. Mater. 37, 523–526 (2001)

    Article  CAS  Google Scholar 

  26. J. Lin, J. Chan, On the Resistance of Silver Migration in Ag-Pd Conductive Thick Films under Humid Environment and Applied d.c. Field. Mate. Chem. Phys. 43, 256–265 (1996)

    Article  CAS  Google Scholar 

  27. J. Wei, Y. Lei, H. Jia, J. Cheng, H. Hou, Z. Zheng, Controlled in Situ Fabrication of Ag2O/AgO Thin Films by a Dry Chemical Route at Room Temperature for Hybrid Solar Cells. Dalton. T. 43, 11333–11338 (2014)

    Article  CAS  Google Scholar 

  28. A. Sobhani-Nasab, M. Behpour, Synthesis and Characterization of AgO Nanostructures by Precipitation Method and its Photocatalyst Application. J. Mater. Sci-Mater. El. 27, 1191–1196 (2016)

    Article  CAS  Google Scholar 

  29. G. Harsányi, G. Inzelt, Comparing Migratory Resistive Short Formation Abilities of Conductor Systems Applied in Advanced Interconnection Systems. Microelectron. Reliab. 41, 229–237 (2001)

    Article  Google Scholar 

  30. D. Yu, W. Jillek, E. Schmitt, Electrochemical Migration of Sn-Pb and Lead Free Solder Alloys under Distilled Water. J. Mater. Sci-Mater. El. 17, 219–227 (2006)

    Article  CAS  Google Scholar 

  31. X. Zhong, G. Zhang, X. Guo, The Effect of Electrolyte Layer Thickness on Electrochemical Migration of Tin. Corros. Sci. 96, 1–5 (2015)

    Article  CAS  Google Scholar 

  32. M. Kaisheva, Electrosorption of Amphiphilic Surfactants at the Mercury-solution Interface and Its Influence on the Stability of Thin Liquid Films. Adv. Colloid. Interf. 38, 319–352 (1992)

    Article  CAS  Google Scholar 

  33. J. Mata, D. Varade, P. Bahadur, Aggregation Behavior of Quaternary Salt Based Cationic Surfactants. Thermoch. Acta. 428, 147–155 (2005)

    Article  CAS  Google Scholar 

  34. B. Liao, Z. Chen, Q. Qiu, X. Guo, Inhibitory Effect of Cetyltrimethylammonium Bromide on the Electrochemical Migration of Tin in Thin Electrolyte Layers Containing Chloride Ions. Corros. Sci. 118, 190–201 (2017)

    Article  CAS  Google Scholar 

Download references

Acknowledgements

This work supported by the National Natural Science Foundation of China (Grant No. 51971067, 52001080), Platform Research Capability Enhancement Project of Guangzhou University (Grant No. 69-620939), Guangzhou University’s 2020 Training Program for Talent (Grant No. 69-62091109), and Science and Technology Research Project of Guangzhou (No. 202002010007).

Author information

Authors and Affiliations

  1. School of Chemistry and Chemical Engineering, Institute of Clean Energy and Materials, Guangzhou Key Laboratory for Clean Energy and Materials, Guangzhou University, Guangzhou, 510006, China

    Bokai Liao, Hong Wang, Lei Kang, Shan Wan & Xingpeng Guo

  2. Tianjin Key Laboratory of Advanced Functional Porous Materials, Institute for New Energy Materials and Low-Carbon Technologies, School of Materials Science and Engineering, Tianjin University of Technology, Tianjin, 300384, China

    Xiaodong Quan

  3. Zhuhai Nanometals Technology Co. Ltd, Zhuhai, 519000, China

    Xiaodong Quan

  4. State Key Laboratory of Oil and Gas Reservoir Geology and Exploitation, Southwest Petroleum University, Chengdu, 610500, China

    Xiankang Zhong

  5. School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China

    Xingpeng Guo

Authors
  1. Bokai Liao
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hong Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Lei Kang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Shan Wan
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Xiaodong Quan
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Xiankang Zhong
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Xingpeng Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Bokai Liao or Xingpeng Guo.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Supplementary Information

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Liao, B., Wang, H., Kang, L. et al. Electrochemical migration behavior of low-temperature-sintered Ag nanoparticle paste using water-drop method. J Mater Sci: Mater Electron 32, 5680–5689 (2021). https://doi.org/10.1007/s10854-021-05289-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-021-05289-8

Search

Navigation