Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion


In this paper, 0.1 wt% Ti particles (2–5 μm) was incorporated into the Sn58Bi solder to improve the properties of Sn58Bi/Cu solder joint. The interface reaction and growth kinetics of the Sn–Cu IMC at the solder/Cu interface during solid–liquid diffusion at temperature of 180, 190 and 200 °C for three different time (10, 20 and 30 min) was systematically investigated. The solder/Cu interface presented a duplex structure of Cu6Sn5 and Cu3Sn IMC. The IMC thickness was developed with the higher soldering temperature and prolonged soldering duration. The diffusion coefficient (D) of different IMC layer increased with the increasing of soldering temperature. The activation energies (Q) of the overall IMC layer were calculated as 48.22 kJ/mol for Sn58Bi solder joint and 58.20 kJ/mol for Sn58Bi–0.1Ti solder joint. Especially, adding the 0.1 wt% Ti particles can inhibit the interfacial IMC growth during solid–liquid diffusion, which may be conducive to the improvement of the solder joint reliability.

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  1. 1.

    N. Jiang, L. Zhang, Z.Q. Liu et al., Reliability issues of lead-free solder joints in electronic devices. Sci. Technol. Adv. Mater. 20(1), 876–901 (2019)

    CAS  Article  Google Scholar 

  2. 2.

    W.B. Zhu, W.W. Zhang, W. Zhou et al., Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders. J. Alloys Compd. 789, 805–813 (2019)

    CAS  Article  Google Scholar 

  3. 3.

    Satyanarayan, M.C. Kumarswamy, K.N. Prabhu, The effect of thermal ageing on solder/substrate interfacial microstructures during reflow of Sn-37Pb and Sn-3Ag-0.5Cu. Trans. Indian Inst. Met. 72, 1545–1549 (2019)

    CAS  Article  Google Scholar 

  4. 4.

    M. Zhao, L. Zhang, Z.Q. Liu et al., Structure and properties of Sn-Cu lead-free solders in electronics packaging. Sci. Technol. Adv. Mater. 20(1), 421–444 (2019)

    CAS  Article  Google Scholar 

  5. 5.

    R.M. Said, M.A.A.M. Salleh, M.I.I. Ramli et al., Growth kinetic of Sn-0.7Cu-0.05Ni solder paste subjected to isothermal aging. Solid State Phenom. 280, 163–168 (2018)

    Article  Google Scholar 

  6. 6.

    L. Zhang, X.Y. Fan, C.W. He et al., Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging[J]. J. Mater. Sci.: Mater. Electron. 24(9), 3249–3254 (2013)

    CAS  Google Scholar 

  7. 7.

    T. Xu, X.W. Hu, Y. Li et al., The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions. J. Mater. Sci.: Mater. Electron. 28(24), 18515–18528 (2017)

    CAS  Google Scholar 

  8. 8.

    H.R. Kotadia, S.H. Mannan, A. Das, Influence of Zn concentration on interfacial intermetallics during liquid and solid state reaction of hypo and hypereutectic Sn-Zn solder alloys. J. Electron. Mater. 48(5), 2731–2736 (2019)

    CAS  Article  Google Scholar 

  9. 9.

    M. Yang, H.T. Chen, X. Ma et al., Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate. J. Mater. Sci. 49(10), 3652–3664 (2014)

    CAS  Article  Google Scholar 

  10. 10.

    F.F. Tian, C.F. Li, M. Zhou et al., The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging. J. Alloy. Compd. 740, 500–509 (2018)

    CAS  Article  Google Scholar 

  11. 11.

    P.J. Shang, Z.Q. Liu, D.X. Li et al., Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging. Philos. Mag. Lett. 91(6), 410–417 (2011)

    CAS  Article  Google Scholar 

  12. 12.

    W. Peng, E. Monlevade, M.E. Marques, Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu. Microelectron. Reliab. 47(12), 2161–2168 (2007)

    CAS  Article  Google Scholar 

  13. 13.

    N. Jiang, L. Zhang, Z.Q. Liu et al., Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder. J. Mater. Sci.: Mater. Electron. 30(19), 17583–17590 (2019)

    CAS  Google Scholar 

  14. 14.

    A.K. Gain, L.C. Zhang, Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder. J. Mater. Sci.: Mater. Electron. 27(1), 781–794 (2016)

    CAS  Google Scholar 

  15. 15.

    T. Maeshima, H. Ikehata, K. Terui et al., Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder. Mater. Des. 103, 106–113 (2016)

    CAS  Article  Google Scholar 

  16. 16.

    M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)

    CAS  Article  Google Scholar 

  17. 17.

    F.J. Wang, H. Chen, Y. Huang et al., Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. J. Mater. Sci.: Mater. Electron. 29, 11409–11420 (2018)

    CAS  Google Scholar 

  18. 18.

    L. Zhang, J.G. Han, Y.H. Guo et al., Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments. Mater. Sci. Eng., A 597, 219–224 (2014)

    CAS  Article  Google Scholar 

  19. 19.

    L.C. Tsao, Suppressing effect of 0.5 wt% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. J. Alloys Compd. 509(33), 8441–8448 (2011)

    CAS  Article  Google Scholar 

  20. 20.

    L. Zhang, S.B. Xue, G. Zeng et al., Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)

    CAS  Article  Google Scholar 

  21. 21.

    X.Y. Liu, M.L. Huang, C.M.L. Wu et al., Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder. J. Mater. Sci.: Mater. Electron. 21(10), 1046–1054 (2010)

    CAS  Google Scholar 

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The present work was carried out with the support of the Key project of State Key Laboratory of Advanced Welding and Joining (AWJ-19Z04), Central Plains science and technology innovation talent plan (ZYQR20180030), National Key Research and Development Project (2019YFF0217400).

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Correspondence to Liang Zhang.

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Jiang, N., Zhang, L., Long, Wm. et al. Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion. J Mater Sci: Mater Electron 32, 3341–3351 (2021).

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