In this paper, 0.1 wt% Ti particles (2–5 μm) was incorporated into the Sn58Bi solder to improve the properties of Sn58Bi/Cu solder joint. The interface reaction and growth kinetics of the Sn–Cu IMC at the solder/Cu interface during solid–liquid diffusion at temperature of 180, 190 and 200 °C for three different time (10, 20 and 30 min) was systematically investigated. The solder/Cu interface presented a duplex structure of Cu6Sn5 and Cu3Sn IMC. The IMC thickness was developed with the higher soldering temperature and prolonged soldering duration. The diffusion coefficient (D) of different IMC layer increased with the increasing of soldering temperature. The activation energies (Q) of the overall IMC layer were calculated as 48.22 kJ/mol for Sn58Bi solder joint and 58.20 kJ/mol for Sn58Bi–0.1Ti solder joint. Especially, adding the 0.1 wt% Ti particles can inhibit the interfacial IMC growth during solid–liquid diffusion, which may be conducive to the improvement of the solder joint reliability.
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The present work was carried out with the support of the Key project of State Key Laboratory of Advanced Welding and Joining (AWJ-19Z04), Central Plains science and technology innovation talent plan (ZYQR20180030), National Key Research and Development Project (2019YFF0217400).
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Jiang, N., Zhang, L., Long, Wm. et al. Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion. J Mater Sci: Mater Electron 32, 3341–3351 (2021). https://doi.org/10.1007/s10854-020-05082-z