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Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints

  • Lei Sun
  • Ming-he Chen
  • Chun-chun Wei
  • Liang Zhang
  • Fan Yang
Article
  • 92 Downloads

Abstract

Low-Ag content SnAgCu solder has drawn more and more researchers’ attention due to the low cost. In this paper, the effect of 0.1 wt% nano-Al particles on interface reaction between Sn1.0Ag0.5Cu and Cu substrate was investigated, and the growth of intermetallic compounds (IMC) and mechanical property of solder joints during − 55 to 125 °C thermal cycling were also analyzed. The results show that the Cu6Sn5 IMC formed at the as-soldered interface and grow obviously with the increase of thermal cycling. The growth rate of IMC in the SnAgCu–0.1Al/Cu is lower than that of SnAgCu/Cu, which indicates that the nano-Al particles can inhibit the diffusion coefficient of IMC layers. Moreover, the shear force of two kinds of solder joints decrease during thermal cycling, but the shear force of SnAgCu–0.1Al is higher than that of SnAgCu.

Notes

Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 51475220), Six Talent Peaks project in Jiangsu Province (No. XCL022), Qing Lan project and State Key Laboratory of Advanced Brazing Filler Metals & Technology (No. SKLABFMT201503).

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Lei Sun
    • 1
  • Ming-he Chen
    • 1
  • Chun-chun Wei
    • 1
  • Liang Zhang
    • 2
  • Fan Yang
    • 2
  1. 1.College of Mechanical & Electrical EngineeringNanjing University of Aeronautics and AstronauticsNanjingChina
  2. 2.School of Mechanical and Electrical EngineeringJiangsu Normal UniversityXuzhouChina

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