Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints

  • Lei Sun
  • Ming-he Chen
  • Chun-chun Wei
  • Liang Zhang
  • Fan Yang


Low-Ag content SnAgCu solder has drawn more and more researchers’ attention due to the low cost. In this paper, the effect of 0.1 wt% nano-Al particles on interface reaction between Sn1.0Ag0.5Cu and Cu substrate was investigated, and the growth of intermetallic compounds (IMC) and mechanical property of solder joints during − 55 to 125 °C thermal cycling were also analyzed. The results show that the Cu6Sn5 IMC formed at the as-soldered interface and grow obviously with the increase of thermal cycling. The growth rate of IMC in the SnAgCu–0.1Al/Cu is lower than that of SnAgCu/Cu, which indicates that the nano-Al particles can inhibit the diffusion coefficient of IMC layers. Moreover, the shear force of two kinds of solder joints decrease during thermal cycling, but the shear force of SnAgCu–0.1Al is higher than that of SnAgCu.



This work was supported by the National Natural Science Foundation of China (No. 51475220), Six Talent Peaks project in Jiangsu Province (No. XCL022), Qing Lan project and State Key Laboratory of Advanced Brazing Filler Metals & Technology (No. SKLABFMT201503).


  1. 1.
    H.J. Ji, M.G. Li, S. Ma, M.Y. Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Mater. Des. 108, 590–596 (2016)CrossRefGoogle Scholar
  2. 2.
    L. Sun, L. Zhang, Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging. Adv. Mater. Sci. Eng. 2015, 1–16 (2015)Google Scholar
  3. 3.
    Z. Sheng, Prediction on Thermal Fatigue Life & Study on the Reliability of QFP Soldered Joint[D]. (Nanjing University of Aeronautics and Astronautics, Nanjing, 2012)Google Scholar
  4. 4.
    S. Tian, S.P. Li, J. Zhou, P. Xue, R.H. Cao, F.J. Wang, Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. J. Mater. Sci.: Mater. Electron. 28(21), 16120–16132 (2017)Google Scholar
  5. 5.
    Y.L. Wang, G.X. Wang, K.X. Song, K.K. Zhang, Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy. Mater. Des. 119, 219–224 (2017)CrossRefGoogle Scholar
  6. 6.
    M.N. Wang, J.Q. Wang, H. Feng, K. Wang, Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder. J. Mater. Sci.: Mater. Electron. 23(1), 148–155 (2012)Google Scholar
  7. 7.
    L. Zhang, J.G. Han, C.W. He, Y.H. Guo, Reliability behavior of lead-free solder joints in electronic components. J. Mater. Sci.: Mater. Electron. 24(1), 172–190 (2013)Google Scholar
  8. 8.
    C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression. J. Mater. Sci.: Mater. Electron. 23(1), 2–7 (2012)Google Scholar
  9. 9.
    L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)CrossRefGoogle Scholar
  10. 10.
    A. Sharma, Y.J. Jang, J.B. Kim, J.P. Jung, Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications. J. Alloys Compd. 704, 795–803 (2017)CrossRefGoogle Scholar
  11. 11.
    Y. Liu, F.L. Sun, H.W. Zhang, P.F. Zou, Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint. J. Mater. Sci.: Mater. Electron. 23(9), 1705–1710 (2012)Google Scholar
  12. 12.
    L. Sun, L. Zhang, L. Xu, S.J. Zhong, J. Ma, L. Bao, Effect of nano-Al addition on properties and microstructure of low-Ag-content Sn-1Ag-0.5Cu solders. J. Mater. Sci.: Mater. Electron. 27(7), 7665–7673 (2016)Google Scholar
  13. 13.
    A. Sharif, Y.C. Chan, M.N. Islam, Dissolution of electroless Ni metallization by lead-free solder alloys. J. Alloys Compd. 388(1), 75–82 (2005)CrossRefGoogle Scholar
  14. 14.
    A.K. Gain, T. Fouzder, Y.C. Chan, K.C. Winco, Yung, Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads. J. Alloys Compd. 509(7), 3319–3325 (2011)CrossRefGoogle Scholar
  15. 15.
    B.L. Chen, G.Y. Li, An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints. IEEE Trans. Compon. Packag. Technol. 28(3), 534–541 (2005)CrossRefGoogle Scholar
  16. 16.
    A.K. Gain, T. Fouzder, Y.C. Chan, A. Sharif, N.B. Wong, W.K.C. Yung, The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads. J. Alloys Compd. 506(1), 216–223 (2010)CrossRefGoogle Scholar
  17. 17.
    S. Tian, S.P. Li, J. Zhou, F. Xue, Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy. J. Alloys Compd. 742, 835–843 (2018)CrossRefGoogle Scholar
  18. 18.
    P. Liu, P. Yao, J. Liu, Evolutions of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150°C. J. Alloys Compd. 486(1–2), 474–479 (2009)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Lei Sun
    • 1
  • Ming-he Chen
    • 1
  • Chun-chun Wei
    • 1
  • Liang Zhang
    • 2
  • Fan Yang
    • 2
  1. 1.College of Mechanical & Electrical EngineeringNanjing University of Aeronautics and AstronauticsNanjingChina
  2. 2.School of Mechanical and Electrical EngineeringJiangsu Normal UniversityXuzhouChina

Personalised recommendations