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Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps

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Abstract

A reduction of the particle size used in solder pastes was shown to affect the electrical and mechanical properties of finely printed solder bumps. Sn–3.0Ag–0.5Cu solder nanoparticles were synthesized using a radio frequency thermal plasma system, and solder pastes were formulated for reverse-offset printing of solder bump arrays with a size of 30 µm. As the nanoparticle ratio in the paste increased, the degree of supercooling, ΔT, increased with a separation of the exothermic peaks for the solidification of β-Sn and the precipitation of intermetallic compounds (IMCs). The networks of finely precipitated IMCs formed at the boundaries of large β-Sn increased the shear strength to 73 MPa. However, insufficient flux deteriorated the electrical and mechanical properties because it delayed the solidification of primary β-Sn as well as the melting of the solder. As a result, the Sn–3.0Ag–0.5Cu solder paste containing a nanoparticle ratio of 25% exhibited an optimum printability for reverse-offset printing of solder bumps, and the resulting bumps had an electrical conductance of 0.4 mΩ and a shear strength of 73 MPa.

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References

  1. K.J. Puttlitz, G.T. Galyon, J. Mater. Sci. Mater. Med. 18, 347–365 (2007)

    Article  CAS  Google Scholar 

  2. L.R. Garcia, W.R. Osório, L.C. Peixoto, A. Garcia, Mater. Charact. 61, 212–220 (2010)

    Article  CAS  Google Scholar 

  3. J. Keller, D. Baither, U. Wilke, G. Schmitz, Acta. Mater. 59, 2731–2741 (2011)

    Article  CAS  Google Scholar 

  4. D. Li, C. Liu, P.P. Conway, J. Electron. Mater. 35, 388–398 (2006)

    Article  CAS  Google Scholar 

  5. R.R. Chromik, R.P. Vinci, S.L. Allen, M.R. Notis, Jom. 55, 66–69 (2003)

    Article  CAS  Google Scholar 

  6. Y. Takamatsu, H. Esaka, K. Shinozuka, Mater. Trans. 52, 189–195 (2011)

    Article  CAS  Google Scholar 

  7. K.S. Kim, S.H. Huh, K. Suganuma, J. Alloys Compd. 352, 226–236 (2003)

    Article  CAS  Google Scholar 

  8. S.L. Tay, A.S.M.A. Haseeb, M. Rafie Johan, Solder. Surf. Mount Technol. 23, 10–14 (2011)

    Article  CAS  Google Scholar 

  9. H. Zhang, Q.S. Zhu, Z.Q. Liu, L. Zhang, H. Guo, C.M. Lai, J. Mater. Sci. Technol. 30, 928–933 (2014)

    Article  CAS  Google Scholar 

  10. P. Yao, P. Liu, J. Liu, J. Alloys Compd. 462, 73–79 (2008)

    Article  CAS  Google Scholar 

  11. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.I. Cho, W.K. Choi, Jom. 56, 34 (2004)

    Article  CAS  Google Scholar 

  12. D. Lin, G.X. Wang, T.S. Srivatsan, M. Al-Hajri, M. Petraroli, Mater. Lett. 53, 333–338 (2002)

    Article  CAS  Google Scholar 

  13. G.Y. Li, X.Q. Shi, Trans. Nonferrous Metals Soc. China 16, 739–743 (2006)

    Article  Google Scholar 

  14. J.X. Wang, S.B. Xue, Z.J. Han, S.L. Yu, Y. Chen, Y.P. Shi, H. Wang, J. Alloys Compd. 467, 219–226 (2009)

    Article  CAS  Google Scholar 

  15. P. Liu, P. Yao, J. Liu, J. Electron. Ma. 37, 874–879 (2008)

    Article  CAS  Google Scholar 

  16. A.K. Gain, Y.C. Chan, W.K. Yung, Microelectron. Reliab. 51, 975–984 (2011)

    Article  CAS  Google Scholar 

  17. L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang, Mater. Des. 31, 4831–4835 (2010)

    Article  CAS  Google Scholar 

  18. S. Chellvarajoo, M.Z. Abdullah, Mater. Des. 90, 499–507 (2016)

    Article  CAS  Google Scholar 

  19. X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, L.Y. Xu, Mater. Sci. Eng. A. Struct. Mater. 562, 25–32 (2013)

    Article  CAS  Google Scholar 

  20. J.H. Lau, J. Electron. Packag. 138, 1–23 (2016)

    Article  Google Scholar 

  21. S.K. Kang, P. Gruber, D.Y. Shih, Jom 60, 66–70 (2008)

    Article  CAS  Google Scholar 

  22. X. Liu, S. Xu, G.Q. Lu, D.A. Dillard, Microelectron. Reliab. 41, 1979–1992 (2001)

    Article  Google Scholar 

  23. H. Hwang, S.M. Hong, J.P. Jung, C.S. Kang, Solder. Surf. Mount Technol. 15(2), 10–16 (2003)

    Article  CAS  Google Scholar 

  24. L.C. Yung, C.C. Fei, J.S. Mandeep, H.B. Abdullah, L.K. Wee, PloS. One. 9(5), 97484 (2014)

    Article  Google Scholar 

  25. E.H. Amalu, N.N. Ekere, S. Mallik, Mater. Des. 32, 3189–3197 (2011)

    Article  CAS  Google Scholar 

  26. T.M. Lee, H.S. Han, B. Kim, S.W. Kwak, J.H. Noh, I. Kim, Thin solid films 548, 566–571 (2013)

    Article  CAS  Google Scholar 

  27. Y.M. Choi, E.S. Lee, T.M. Lee, K.Y. Kim, Microelectron. Eng. 134, 1–6 (2015)

    Article  CAS  Google Scholar 

  28. Y. Gao, C. Zou, B. Yang, Q. Zhai, J. Liu, E. Zhuravlev, C. Schick, J. Alloys Compd. 484, 777–781 (2009)

    Article  CAS  Google Scholar 

  29. C. Andersson, C. Zou, B. Yang, Y. Gao, J. Liu, Q. Zhai, In Electronics System-Integration Technology Conference. 2, pp. 915–922 (2008)

  30. J. Szépvölgyi, I. Mohai, Z. Károly, L. Gál, J. Eur. Ceram. Soc. 28, 895–899 (2008)

    Article  Google Scholar 

  31. M.J. Son, M. Kim, T.M. Lee, J. Kim, H.J. Lee, I. Kim, J. Mater. Process. Technol. 259, 126–133 (2018)

    Article  CAS  Google Scholar 

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Acknowledgements

This research was supported by the Technology Innovation Program (10080746) of the Ministry of Trade, Industry & Energy (MOTIE, Korea), and the R&D Convergence Program of the National Research Council for Science and Technology for the Republic of Korea (CAP-15-04-KITECH).

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Authors and Affiliations

  1. Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), Daejeon, 305-343, Republic of Korea

    Min-Jung Son, Hyunchang Kim, Taik-Min Lee & Inyoung Kim

  2. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, 440-746, Republic of Korea

    Min-Jung Son & Hoo-Jeong Lee

  3. Powder Technology Department, Korea Institute of Materials Science, Changwon, 51508, Republic of Korea

    Jae Won Jeong

  4. Department of Nano Mechatronics, Korea University of Science & Technology (UST), 217 Gajeong-ro, Daejeon, 34113, Republic of Korea

    Taik-Min Lee & Inyoung Kim

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  1. Min-Jung Son
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  2. Jae Won Jeong
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  3. Hyunchang Kim
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  4. Taik-Min Lee
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  5. Hoo-Jeong Lee
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Correspondence to Hoo-Jeong Lee or Inyoung Kim.

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Son, MJ., Jeong, J.W., Kim, H. et al. Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps. J Mater Sci: Mater Electron 29, 19620–19631 (2018). https://doi.org/10.1007/s10854-018-0021-1

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  • DOI: https://doi.org/10.1007/s10854-018-0021-1

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