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Embedded nonlinear passive components on flexible substrates for microelectronics applications

  • Dipankar Ghosh
Article
  • 201 Downloads

Abstract

This paper describes nonlinear dielectric composite passive components on flexible metallic substrates for transient protection of electronic devices, most notably against electrostatic discharge (ESD) and electrical overstress (EOS) conditions. In this case, the passive device comprises a polymer composite that contains nonlinear inorganic fillers, an electric field switchable dielectric ceramic Calcium Copper Titanate (CaCu3Ti4O12, CCT), in a metal insulator metal (MIM) configuration. Compatibility with PCB (printed circuit board) in line processing is demonstrated since the fabrication process described is a relatively low temperature process. Advantageously, the construction of such components are such that they can be embedded within a PCB (printed circuit board), thereby allowing miniaturization of the circuit design and can potentially be adopted in an industrial roll to roll manufacturing process. The dielectric characteristics of the CCT filler polymer composites are compared with well-known high dielectric constant Barium Titanate filler polymer composites for capacitor applications. Theoretical models based on effective medium theory are used to predict the dielectric properties of the CCT epoxy composites as a function of filler loading fractions. Maxwell Garnett model was found to provide the best fit to experimental data.

Keywords

Epoxy Composite Dielectric Loss Tangent Metal Insulator Metal Effective Dielectric Constant Metal Insulator Metal 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

The author would like to acknowledge useful discussions with Rui Yang and Grace Jiang and would like to thank Myles Brostrom for XRD and Jeff Payne for SEM.

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Copyright information

© Springer Science+Business Media New York 2017

Authors and Affiliations

  1. 1.3M Corporate Research LaboratorySaint PaulUSA

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