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Effect of electrodepositing Ag on DC etching aluminum foils for electrolytic capacitor

  • C. L. Ban
  • S. Q. Zhu
  • J. L. Hou
  • F. R. Wang
  • J. Wang
Article

Abstract

Ag nuclei were electrodeposited on the surface of aluminum foil to induce tunnel etching. The effects of Ag nuclei on the surface and cross-section etching morphologies and electrochemical behavior of Al foil was investigated with SEM, polarization curve (PC) and electrochemical impedance spectroscopy (EIS). It is proved that the tunnels etched in this way are distributed more uniformly and the density of tunnels and pits are enhanced, leading to increase in specific capacitance of etched Al foil. These effects can be attributed to the mechanism that the Ag nuclei can serve as the favorable sites for tunnel initiation on aluminum foil surface owing to the formation of Ag–Al micro-batteries, in which Ag is cathode and Al is anode. This mechanism is supported by the SEM, PC and EIS.

Keywords

Electrochemical Impedance Spectroscopy Aluminum Foil Tunnel Widening Anodic Oxide Film Electrolytic Capacitor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

The work is financially supported by the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016BP05), Postdoctoral Science Foundation Shandong Agricultural University and Science, Technology and Culture Innovation Fund for Student of Liaocheng University (Grant No. 26312161914).

References

  1. 1.
    C.L. Ban, Y.D. He, X. Shao, J. Mater. Sci. Mater. Electron. 24, 3442 (2013)CrossRefGoogle Scholar
  2. 2.
    C.L. Ban, Y.D. He, X. Shao, L.P. Wang, J. Mater. Sci. Mater. Electron. 25, 128 (2014)CrossRefGoogle Scholar
  3. 3.
    S.Q. Zhu, C.L. Ban, L.J. Jiang, J. Mater. Sci. Mater. Electron. 26, 5703 (2015)CrossRefGoogle Scholar
  4. 4.
    Z.S. Feng, J.J. Chen, R. Zhang, N. Zhao, Ceram. Int. 38, 3057 (2012)CrossRefGoogle Scholar
  5. 5.
    L. Xiang, S.S. Park, Appl. Surf. Sci. 388, 245 (2016)CrossRefGoogle Scholar
  6. 6.
    X.F. Du, Y.L. Xu, J. Sol-Gel. Sci. Technol. 45, 57 (2008)CrossRefGoogle Scholar
  7. 7.
    S.S. Park, B.T. Lee, J. Electroceram. 13, 111 (2008)CrossRefGoogle Scholar
  8. 8.
    C.L. Ban, J.L. Hou, S.Q. Zhu, C.Z. Wang, J. Mater. Sci. Mater. Electron. 27, 1547 (2016)CrossRefGoogle Scholar
  9. 9.
    C.L. Ban, Y.D. He, X. Shao, Corros. Sci 78, 7 (2014)CrossRefGoogle Scholar
  10. 10.
    C.L. Ban, Y.D. He, X. Shao, J. Du, Trans. Nonferr. Met. Soc. China 23, 1039 (2013)CrossRefGoogle Scholar
  11. 11.
    C.L. Ban, Y.D. He, Trans. Nonferr. Met. Soc. China 19, 601 (2009)CrossRefGoogle Scholar
  12. 12.
    C.L. Ban, S.Q. Zhu, X.Q. Tao, W.Y. Chen, J. Mater. Sci. Mater. Electron. 27, 12074 (2016)CrossRefGoogle Scholar
  13. 13.
    Y.H. Chiu, B.L. Ou, Y.L. Lee, Korean J. Chem. Eng. 24, 881 (2007)CrossRefGoogle Scholar
  14. 14.
    Z. Ashitaka, G.E. Thompson, P. Skeldon, G.C. Wood, K. Shimizu, J. Electrochem. Soc. 146, 1380 (1999)CrossRefGoogle Scholar
  15. 15.
    W. Lin, G.C. Tu, Y.M. Peng, Corros. Sci. 38, 889 (1996)CrossRefGoogle Scholar
  16. 16.
    J. Tan, J.C. Walmsley, B. Holme, H. Nordmark, K. Nisancioglu, Corros. Sci. 68, 204 (2013)CrossRefGoogle Scholar
  17. 17.
    K. Arai, T. Suzuki, T. Atsumi, J. Electrochem. Soc. 132, 1667 (1985)CrossRefGoogle Scholar
  18. 18.
    S.Q. Zhu, C.L. Ban, X.Q. Tao, W.Y. Chen, L.J. Jiang, J. Mater. Sci. Mater. Electron. 26, 6750 (2015)CrossRefGoogle Scholar
  19. 19.
    N. Peng, Y.D. He, H.Z. Song, X.F. Yang, X.Y. Cai, Corros. Sci. 91, 2013 (2015)CrossRefGoogle Scholar
  20. 20.
    T. Fukushima, A. Takeda, K. Nishio, H. Masuda, Electrochem. Solid State 13, C17 (2010)CrossRefGoogle Scholar
  21. 21.
    W. Lin, G.C. Tu, C.F. Lin, Y.M. Peng, Corros. Sci. 39, 1531 (1997)CrossRefGoogle Scholar
  22. 22.
    C.L. Ban, Y.D. He, X. Shao, J. Du, L.P. Wang, Trans. Nonferr. Met. Soc. China 23, 3650 (2013)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 2017

Authors and Affiliations

  • C. L. Ban
    • 1
    • 2
  • S. Q. Zhu
    • 3
  • J. L. Hou
    • 2
  • F. R. Wang
    • 1
  • J. Wang
    • 1
  1. 1.School of Materials Science and EngineeringLiaocheng UniversityLiaochengChina
  2. 2.Mechanical and Electronic Engineering CollegeShandong Agricultural UniversityTai’anChina
  3. 3.School of Computer ScienceLiaocheng UniversityLiaochengChina

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