Mixed ink of copper nanoparticles and copper formate complex with low sintering temperatures
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A kind of copper mixed ink with low sintering temperatures was developed. The mixed ink was composed of copper nanoparticles and copper formate 3-dimethylamino-1,2-propanediol (DMAPD) complex. TG-MS showed a two-step decomposition process of the mixed ink below 200 °C. The copper formate DMAPD complex decomposed to copper nanoparticles at about 140 °C. The freshly formed small copper nanoparticles dispersed around the large copper nanoparticles of the ink, and then sintered at relatively low temperatures to form connections between larger nanoparticles. The copper films were obtained by thermally sintering of the mixed ink films at different temperatures. The mixed ink with 38 wt% of copper formate complex gave a film with the lowest resistivity of 18 μΩ cm after sintering at 200 °C, which is less than one thirtieth of that of the film without copper formate complex at the same sintering temperature. The morphology analysis showed the dense copper films from the mixed ink, in contrast to the loose film from the organic decomposition ink made of copper formate complex.
KeywordsCopper Nanoparticles Copper Film Copper Formate Electrical Conductive Adhesive Lactic Acid Solution
This research was supported by the National Science and Technology Major Project of China (No. 2013ZX02505).