Effect of nano-TiO2 addition on microstructural evolution of small solder joints
- 180 Downloads
The influence of TiO2 addition on the interfacial reaction in Sn–3.0Ag–0.5Cu solder joints with the pad size of 200 µm was investigated in this study. The microstructure of the solder joints and the interfacial intermetallic layers were analyzed by scanning electron microscope. Results show that both the thickness and grain size of the intermetallic compound (IMC) decreases when TiO2 is added. The Sn–3.0Ag–0.5Cu–0.1TiO2 solder exhibits the most prominent effect in retarding interfacial IMC growth and refining IMC grain size. It is observed that the scallop morphology became more faceted in shape compared with the large size Cu/solder interface, where the Cu6Sn5 grains appear to be round shape no matter the reflow time is long or short. The cause might be due to the change in interfacial energy between the molten solder and Cu6Sn5 phase, which is highly correlated with the Cu concentration profile near the interface in the side of the liquid solder.
KeywordsTiO2 Solder Joint Solder Ball Composite Solder Molten Solder
This research is supported by the Planned Science and Technology Project of Guangdong Province, China (No. 2013B010403003). The authors would like to acknowledge the support of the National Natural Science Foundation of Guangdong, China (No. 2014A030313594), and the Planned Science and Technology Project of Guangdong Province, China (No. 2015A020209179).
- 1.P. Hedge, D.C. Whalley, V.V. Silberschmidt, in European Microelectronics and Packaging Conference (IEEE, Rimini, 2009), pp. 1–9Google Scholar
- 3.L.M. Yin, W.Y. Li, S. Wei, Z.L. Xu, in 12th International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, Shanghai, 2011), pp. 832–834Google Scholar
- 7.Y.S. Park, et al., in Proceedings of the 60th Electronic Components and Technology Conference (IEEE, Nevada, 2010), pp. 1436–1441Google Scholar
- 8.M.L. Huang and F. Yang, Sci. Rep.UK 4, 7117, (2014)Google Scholar