Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
Considering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, ΔQe is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of −40 to 125 °C and a superimposed electric current with current densities of 17.4–22.4 × 104 A/cm2. The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.
KeywordsSolder Joint Acceleration Factor Creep Damage Creep Strain Rate Plastic Strain Amplitude
This work was supported by the Natural Science Foundation of China, Grant Nos. 51171191 and 51471180, the Major National Science and Technology Program of China, Grant No. 2011ZX02602, and Natural Science Foundation of Liaoning Province, Grant No. 2013020015.
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