Skip to main content
Log in

Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

In this study, the effects of Bi addition on the interfacial reactions and mechanical properties of In–3Ag–xBi/Cu joints were investigated. Better wettability was obtained with increased addition of Bi (0–2 wt%), but further additions up to 3 wt% decreased the beneficial effects. The intermetallic compounds (IMCs) formed at In–3Ag–xBi/Cu interfaces were (Ag,Cu)In2 in all cases. With the increase of Bi addition, the interfacial IMC grains coarsened and the IMC layers got thicker. The EPMA mapping revealed that Bi addition reacted with neither In or Ag to form intermetallics, it dissolved as solid solution in Indium matrix uniformly. In addition, the shear strength of the soldered joints were improved by Bi addition, with the peak shear strength occurring at 2 wt% Bi addition. The fracture mode also changed from typical ductile fracture mode to mixed ductile–brittle fracture mode with increased amount of Bi addition.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. T.H. Chuang, C.C. Jain, S.S. Wang, J. Mater. Eng. Perform. 18, 1133 (2009)

    Article  Google Scholar 

  2. H.L. Reynolds, S.H. Kang, J.W. Morris, J. Electron. Mater. 28, 69 (1999)

    Article  Google Scholar 

  3. T. Hisada, I. Shohji, Y. Yamada, K. Toriyama, M. Ueno, in IEEE CPMT Symposium Japan (ICSJ), 2013, vol. 3, p. 1 (2013)

  4. J. Glazer, Int. Mater. Rev. 40, 65 (1995)

    Article  Google Scholar 

  5. K. Shimizu, T. Nakanishi, K. Karasawa, K. Hashimoto, K. Niwa, J. Electron. Mater. 24, 39 (1995)

    Article  Google Scholar 

  6. W.W. So, C.C. Lee, IEEE Trans. Compon. Packaging Technol. 23, 377–382 (2000)

    Article  Google Scholar 

  7. H. Qi, M. Osterman, M. Pecht, IEEE Trans. Compon. Packaging Technol. 30, 242–247 (2007)

    Article  Google Scholar 

  8. J. Shen, S.Q. Lai, Y.C. Liu, H.X. Gao, J. Wei, J. Mater. Sci.: Mater. Electron. 19(3), 275–280 (2008)

    Google Scholar 

  9. C.M.L. Wu, Y.W. Wong, J. Mater. Sci.: Mater. Electron. 18(1–3), 77–91 (2007)

    Google Scholar 

  10. N. Zhao, M.L. Huang, H.T. Ma, F. Yang, Z.J. Zhang, Met. Mater. Int. 20, 953 (2014)

    Article  Google Scholar 

  11. L. Gao, S. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S. Yu, G. Zeng, Microelectron. Eng. 87, 2025 (2010)

    Article  Google Scholar 

  12. J. Zhou, Y.S. Sun, F. Xue, J. Alloys Compd. 397, 260–264 (2005)

    Article  Google Scholar 

  13. J. Zhao, L. Qi, X. Wang, L. Wang, J. Alloys Compd. 375, 196–201 (2004)

    Article  Google Scholar 

  14. J. Chen, J. Shen, D. Min, C.F. Peng, J. Mater. Sci.: Mater. Electron. 20(11), 1112–1117 (2009)

    Google Scholar 

  15. H.M. Chen, C.J. Guo, J.P. Huang, H. Wang, J. Mater. Sci.: Mater. Electron. 26, 5459–5464 (2015)

    Google Scholar 

  16. N. Zhao, M.L. Huang, Y. Zhong, H.T. Ma, X.M. Pan, J. Mater. Sci.: Mater. Electron. 26, 345–352 (2015)

    Google Scholar 

  17. J.M. Song, T.S. Lui, Y.L. Chang, L.H. Chen, J. Alloys Compd. 403, 191–196 (2005)

    Article  Google Scholar 

  18. W.X. Dong, Y.W. Shi, Z.D. Xia, Y.P. Lei, Y.F. Guo, J. Electron. Mater. 37, 982 (2008)

    Article  Google Scholar 

  19. T. Iwasaki, J.H. Kim, S. Mizuhashi, M. Satah, J. Electron. Mater. 34, 647–654 (2005)

    Article  Google Scholar 

  20. H. Fallahi, M.S. Nurulakmal, A.F. Arezodar, J. Mater. Sci.: Mater. Electron. 23, 1739 (2012)

    Google Scholar 

  21. J. Zhao, C.Q. Cheng, L. Qi, C.Y. Chi, J. Alloys. Compd. 473, 382–388 (2009)

    Article  Google Scholar 

  22. K. Suganuma, K.S. Kim, J. Mater. Sci.: Mater. Electron. 18, 121–127 (2007)

    Google Scholar 

  23. L.F. Li, Y.K. Cheng, G.L. Xu, E.Z. Wang, Z.H. Zhang, H. Wang, Mater. Des. 64, 15–20 (2014)

    Article  Google Scholar 

  24. A.A. El-Daly, Y. Swilem, M.H. Markled, M.G. El-Shaarawy, A.M. Abdraboh, J. Alloys Compd. 484, 134–142 (2009)

    Article  Google Scholar 

  25. M.L. Huang, L. Wang, Metall. Mater. Trans. A 36, 1439–1446 (2005)

    Article  Google Scholar 

  26. Z. Moser, W. Gasior, J. Pstrus, W. Zakulski, I. Ohnuma, X.J. Liu, Y. Inohana, K. Ishida, J. Electron. Mater. 30, 1120 (2001)

    Article  Google Scholar 

  27. H.S. Liu, Y. Cui, X.J. Liu, C.P. Wang, I. Ohnuma, R. Kainuma, Z.P. Jin, K. Ishida, J. Phase Equilib. Diffus. 23, 409 (2002)

    Article  Google Scholar 

  28. W.X. Chen, S.B. Xue, H. Wang, Y.H. Hu, J.X. Wang, J. Mater. Sci.: Mater. Electron. 21, 719–725 (2010)

    Google Scholar 

  29. L. Yang, J.G. Ge, Y.C. Zhang, J. Dai, Y.F. Jing, J. Mater. Sci.: Mater. Electron. 26, 613–619 (2015)

    Google Scholar 

  30. L. Yang, J. Mater. Sci.: Mater. Electron. 24, 1405–1409 (2013)

    Google Scholar 

  31. Satyanarayan, K.N. Prabhu, Adv. Colloid Interface Sci. 166, 87 (2011)

    Article  Google Scholar 

  32. S. Chantaramanee, S. Wisutmethangoon, L. Sikong, T. Plookphol, J. Mater. Sci.: Mater. Electron. 24, 3707–3715 (2013)

    Google Scholar 

  33. X. Chen, F. Xue, J. Zhou, Y. Yao, J. Alloys Compd. 633, 377–383 (2015)

    Article  Google Scholar 

  34. P. Pavel, T. Anne, T. Vladimir, E. Nicolas, Scr. Mater. 45, 1439–1445 (2001)

    Article  Google Scholar 

  35. C. Zhang, S.D. Liu, G.T. Qian, J. Zhou, F. Xue, Trans. Nonferrous Metals Soc. China 24(1), 184–191 (2014)

    Article  Google Scholar 

  36. J.J. Sundelin, S.T. Nurmi, T.K. Lepisto, E.O. Ristolainen, Mater. Sci. Eng. A 420, 55 (2006)

    Article  Google Scholar 

  37. M.L. Huang, Q. Zhou, N. Zhao, L.D. Chen, J. Mater. Sci.: Mater. Electron. 24, 2624–2629 (2013)

    Google Scholar 

  38. Y.H. Lee, H.T. Lee, Mater. Sci. Eng. A 444, 75 (2007)

    Article  Google Scholar 

Download references

Acknowledgments

The author thanks the National Natural Science Foundation of China (No. 50774098) and Creative research group of National Natural Science Foundation of China (Grant No. 50721003) for the financial support.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Yunzhu Ma.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Ma, Y., Luo, H., Liu, W. et al. Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints. J Mater Sci: Mater Electron 27, 103–110 (2016). https://doi.org/10.1007/s10854-015-3724-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-015-3724-6

Keywords

Navigation