Microstructure and properties of Al/Sip composites for thermal management applications
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Aluminum matrix composite reinforced with high amount of Si particle is an advanced electronic packaging material used in thermal management. In this work, Al/Sip composites with different Si contents were prepared by rapid solidification and hot pressing. Fine and homogeneous microstructures with defect-free were achieved, and no detrimental reaction was detected. The typical thermo-physical properties such as the thermal conductivity and coefficient of thermal expansion (CTE) of the Al/Sip composites were acceptable as electronic packaging material for semiconductor devices. The CTE increased gradually with the temperature. Additionally, the mechanical properties of the composites were measured. The technological performance (workability, platability, and laser weldability) of the composites were also evaluated.
KeywordsLaser Welding Rapid Solidification Brinell Hardness Aluminum Matrix Composite Electronic Packaging Material
The authors would like to thank for the financial support from the National Key Fundamental Research Project of China (JPPT-125-14).
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