Creep behavior of SnAgCu solders containing nano-Al particles
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In our previous work, a small amount of Al nanoparticles can improve the wettability and mechanical properties of SnAgCu lead-free solders. In this paper, creep properties of SnAgCu solder alloys containing 0.1 wt% Al nanoparticles were studied based on creep testing. It is found that with the addition of Al nanoparticles can enhance the creep resistance of SnAgCu solders. And the Garofalo–Arrhenius creep model was used to describe the creep behavior of SnAgCu and SnAgCu–0.1nano Al solder joints, the parameters were determined based on creep testing. And finite element analysis was utilized to represent the accumulated creep response and calculate the creep fatigue life of solder joints.
KeywordsFatigue Life Solder Joint Creep Strain Creep Behavior Creep Resistance
The present work was carried out with the supported by the Natural Science Foundation of Jiangsu Province (BK2012144); the Natural Science Foundation of China (51475220).
- 8.L. Zhang, J.G. Han, Y.H. Guo, C.W. He, J. Zhang, Microstructures and properties of SnAgCu solders bearing nano-particles Al. Trans. China Weld. Inst. 34(6), 65–68 (2013)Google Scholar
- 15.Y.F. Hu, S.B. Xue, Y.X. Wu, FEM analysis of stress and strain and evaluation on reliability of soldered BGA joints under thermal cycling. Trans. Nonferrous Metals Soc. China 15(S3), 317–322 (2005)Google Scholar