Creep behavior of SnAgCu solders containing nano-Al particles

  • Liang Zhang
  • Ji-guang Han
  • Yong-huan Guo
  • Lei Sun


In our previous work, a small amount of Al nanoparticles can improve the wettability and mechanical properties of SnAgCu lead-free solders. In this paper, creep properties of SnAgCu solder alloys containing 0.1 wt% Al nanoparticles were studied based on creep testing. It is found that with the addition of Al nanoparticles can enhance the creep resistance of SnAgCu solders. And the Garofalo–Arrhenius creep model was used to describe the creep behavior of SnAgCu and SnAgCu–0.1nano Al solder joints, the parameters were determined based on creep testing. And finite element analysis was utilized to represent the accumulated creep response and calculate the creep fatigue life of solder joints.


Fatigue Life Solder Joint Creep Strain Creep Behavior Creep Resistance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The present work was carried out with the supported by the Natural Science Foundation of Jiangsu Province (BK2012144); the Natural Science Foundation of China (51475220).


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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Liang Zhang
    • 1
    • 2
  • Ji-guang Han
    • 1
  • Yong-huan Guo
    • 1
  • Lei Sun
    • 1
  1. 1.School of Mechanical and Electrical EngineeringJiangsu Normal UniversityXuzhouChina
  2. 2.Department of Materials Science and EngineeringUniversity of CaliforniaLos AngelesUSA

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