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Wettability optimization analysis of lead-free solders with Taguchi method

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Abstract

In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the wettability of the lead-free solder joints were examined and calculated. Moreover, the effect of rare earth Eu on the wetting of SnAgCu solder was investigated, the effect mechanism was analyzed too. The wettability optimal design in the lead-free solders system has the combination of the SnAgCu-0.04Eu solder, RMA flux, Au/Ni/Cu substrate, and vacuum atmosphere. Moreover, the flux is the most important factor among the control factors in the wettability system.

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Acknowledgments

The present work was carried out with the support of the Natural Science Foundation of China(51475220); Natural Science Foundation of Jiangsu Province (BK2012144) and the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province (12KJB460005).

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Lei Sun, Ji-guang Han & Yong-huan Guo

  2. Department of Materials Science and Engineering, University of California, Los Angeles, CA, 90095, USA

    Liang Zhang

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  1. Liang Zhang
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  2. Lei Sun
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  4. Yong-huan Guo
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Correspondence to Liang Zhang.

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Zhang, L., Sun, L., Han, Jg. et al. Wettability optimization analysis of lead-free solders with Taguchi method. J Mater Sci: Mater Electron 26, 2605–2608 (2015). https://doi.org/10.1007/s10854-015-2730-z

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  • DOI: https://doi.org/10.1007/s10854-015-2730-z

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