Wettability optimization analysis of lead-free solders with Taguchi method



In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the wettability of the lead-free solder joints were examined and calculated. Moreover, the effect of rare earth Eu on the wetting of SnAgCu solder was investigated, the effect mechanism was analyzed too. The wettability optimal design in the lead-free solders system has the combination of the SnAgCu-0.04Eu solder, RMA flux, Au/Ni/Cu substrate, and vacuum atmosphere. Moreover, the flux is the most important factor among the control factors in the wettability system.


Wettability Control Factor Orthogonal Array Solder Alloy Taguchi Method 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The present work was carried out with the support of the Natural Science Foundation of China(51475220); Natural Science Foundation of Jiangsu Province (BK2012144) and the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province (12KJB460005).


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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Liang Zhang
    • 1
    • 2
  • Lei Sun
    • 1
  • Ji-guang Han
    • 1
  • Yong-huan Guo
    • 1
  1. 1.School of Mechanical and Electrical EngineeringJiangsu Normal UniversityXuzhouChina
  2. 2.Department of Materials Science and EngineeringUniversity of CaliforniaLos AngelesUSA

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