Properties of calcium copper titanate and barium titanate filled epoxy composites for electronic applications: effect of filler loading and hybrid fillers



Inorganic ceramics such as calcium copper titanate, CaCu3Ti4O12 (CCTO) and barium titanate (BaTiO3) were used as fillers to produce epoxy thin film composites for capacitor application. The effects of filler types and loading range on the dielectric, tensile, morphology, and thermal properties of the epoxy thin film composites were determined. Results showed that epoxy thin film composites with 20 vol% filler loading of CCTO and BaTiO3 showed good dielectric properties, thermal stability, and thermal conductivity. However, the tensile properties of the CCTO/epoxy thin film composite was reduced as the filler loading increased. On the other hand, the tensile properties of BaTiO3/epoxy thin film composite improved as the filler loading increased. Hybrid fillers CCTO and BaTiO3 filled epoxy composites were fabricated and the effect of hybrid fillers on the dielectric properties and morphology of the epoxy thin film composites were investigated. Results indicated that positive hybrid effect in dielectric constant and dielectric loss showed by the hybrid composites.


Dielectric Loss BaTiO3 Filler Loading Barium Strontium Titanate Thin Film Composite 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The authors gratefully acknowledge the support of the Universiti Sains Malaysia and the Ministry of Education, and Explorating Research Grant Scheme (ERGS) for granting the research fund used for this project (Project No. 6730109).


  1. 1.
    W.S. Mao, J. Endruw, K.Y. Wen, W.J. Wen, 9th Electron. Packag. Tech. Conf. (EPTC), IEEE (2007)Google Scholar
  2. 2.
    Y. Rao, S. Ogitani, P. Koul, C.P. Wong, J. Appl. Polym. Sci. 83, 1084 (2002)CrossRefGoogle Scholar
  3. 3.
    C.S. Dong, L.J. Yeon, H.J. Gul, P.K. Wook, J. Mater. Sci. Eng. B110, 233 (2004)Google Scholar
  4. 4.
    L. Jiongxin, M. Kyoung-Sik, K. Byung-Kook, C.P. Wong, J. Polym. 48(6), 1510 (2007)CrossRefGoogle Scholar
  5. 5.
    W.C. Ching, C.Y. Chung, S.C. Cheng, Y.C. Fu, J. Eur. Polym. 45, 1442 (2009)CrossRefGoogle Scholar
  6. 6.
    L. Jiongxin, C.P. Wong, IEEE Trans. Dielectr. Electr. Insul. 15(5), 1322 (2008)CrossRefGoogle Scholar
  7. 7.
    K. Taeyun, I.K. Angus, M.J. Paul, T.C. Robert, Thin Solid Films 515, 7331 (2007)CrossRefGoogle Scholar
  8. 8.
    M. Alam, M.H. Azarian, M. Osterman, M. Pecht, Microelectron. Reliab. 51(5), 946 (2011)CrossRefGoogle Scholar
  9. 9.
    L. Xie, X. Huang, C. Wu, P. Jiang, J. Mater. Chem. 21, 5897 (2011)CrossRefGoogle Scholar
  10. 10.
    Z.M. Dang, J.W. Zha, Y. Yu, T. Zhou, H.T. Song, S.T. Li, IEEE Trans. Dielectr. Electr. Insul. 18(5), 1518 (2011)CrossRefGoogle Scholar
  11. 11.
    X. Huang, L. Xie, Z. Hu, P. Jiang, IEEE Trans. Dielectr. Electr. Insul. 18(2), 375 (2011)CrossRefGoogle Scholar
  12. 12.
    H.J. Ming, Y.W. Huai, Y.W. Chun, C.Y. Wen, C.Y. Yu, J. Mater. Res. Bull. 40, 1662 (2005)CrossRefGoogle Scholar
  13. 13.
    J.R. Yoon, H.J. Woo, K.M. Lee, Trans. Electr. Electron. Mater. 10(4), 449 (2009)CrossRefGoogle Scholar
  14. 14.
    L. Suibin, S. Rong, Z. Jingwei, Y. Shuhui, D. Ruxu, Z. Zhijun, Intern. Conf. Electron. Packag. Tech. High Density Pack. (ICEPT-HDP), IEEE (2009)Google Scholar
  15. 15.
    M.A. Subramanian, D. Li, N. Duran, B.A. Reisner, A.W. Sleight, J. Solid State Chem. 151, 323 (2000)CrossRefGoogle Scholar
  16. 16.
    C.C. Homes, T. Vogt, S.M. Shapiro, S. Wakimoto, A.P. Ramirez, Science 293, 673 (2001)CrossRefGoogle Scholar
  17. 17.
    M.A. Subramanian, D. Li, N. Duan, J. Solid State Chem. 151, 323 (2000)CrossRefGoogle Scholar
  18. 18.
    M. Nakach, J.R. Authelin, A. Chamayou, J. Dodds, J. Miner. Proc. 74, 173 (2004)CrossRefGoogle Scholar
  19. 19.
    L. Ramajo, M. Reboredo, M. Castro, Compos. Part A 36, 1267 (2005)CrossRefGoogle Scholar
  20. 20.
    L. Ramajo, M.A. Ramirez, P.R. Bueno, M.M. Reboredo, Mater. Res. 11(1), 85 (2008)CrossRefGoogle Scholar
  21. 21.
    B.S. Prakash, K.B.R. Varma, J. Compos. Sci. Technol. 67, 2362 (2007)Google Scholar
  22. 22.
    N.G. Devaraju, E.S. Kim, B.I. Lee, Microelectron. Eng. 82(1), 71 (2005)CrossRefGoogle Scholar
  23. 23.
    P. Thomas, K.T. Varughese, K. Dwarakanath, K.B.R. Varma, J. Compos. Sci. Technol. 70, 539 (2010)CrossRefGoogle Scholar
  24. 24.
    G. Tsangaris, N. Kouloumbi, S. Kyvelidis, Mater. Chem. Phys. 44(3), 245 (1996)CrossRefGoogle Scholar
  25. 25.
    R. Voo, M. Mariatti, L.C. Sim, J. Plast. Film Sheet. 27, 331 (2011)CrossRefGoogle Scholar
  26. 26.
    C.L. Wu, M.Q. Zhang, M.Z. Rong, K. Friedrich, J. Compos. Sci. Technol. 62, 1327 (2002)CrossRefGoogle Scholar
  27. 27.
    C.L. Poh, M. Mariatti, M.N. Ahmad Fauzi, C.H. Ng, C.K. Chee, T.P. Chuah, J. Mater. Sci. Mater. Electron. 25, 2111 (2014)CrossRefGoogle Scholar
  28. 28.
    H. Schonhorn, J. Plast. Film Sheet. 1, 163 (1985)CrossRefGoogle Scholar
  29. 29.
    F.C. Campbell, Introduction to composite materials, structural composite materials (ASM International, OH, 2010), p. 8Google Scholar
  30. 30.
    R. Voo, M. Mariatti, L.C. Sim, J. Polym. Adv. Technol. 23, 1620 (2012)CrossRefGoogle Scholar
  31. 31.
    S.H. Xie, B.K. Zhu, J.B. Li, X.Z. Wei, Z.K. Xu, Polym. Test 23(7), 797 (2004)CrossRefGoogle Scholar
  32. 32.
    A. Leszczynska, J. Njuguna, K. Pielichowski, J.R. Banerjee, Thermochim. Acta 453, 75 (2007)CrossRefGoogle Scholar
  33. 33.
    N.G. Devaraju, E.S. Kim, B.I. Lee, Microelectron. Eng. 82(1), 71 (2005)CrossRefGoogle Scholar
  34. 34.
    R. Kochetov, T. Andritsch, U. Lafont, P. H. F. Morshuis, J.J. Smit, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 2009Google Scholar
  35. 35.
    K.A. Malini, E.M. Mohammed, S. Sindhu, J. Mater. Sci. 36, 5551 (2001)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 2014

Authors and Affiliations

  1. 1.School of Materials and Mineral Resources Engineering, Engineering CampusUniversiti Sains MalaysiaNibong TebalMalaysia

Personalised recommendations