Skip to main content
SpringerLink
Log in

Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Growth kinetics of intermetallic compound (IMC) layers formed between SnAgCu solder for reflow soldering and Cu substrate by solid state isothermal aging were investigated at temperatures between 100 and 140 °C. For the aged samples, two distinct layers of IMCs of the type Cu6Sn5 and Cu3Sn were identified with the later adjacent to the copper substrate. In the as-soldered samples, only a single layer of interfacial Cu6Sn5 type IMC was formed. Moreover, the apparent activation energies were 96.75 kJ/mol (total IMC), 85.98 kJ/mol (Cu6Sn5 IMC) and 105.92 kJ/mol (Cu3Sn IMC), respectively.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5

Similar content being viewed by others

References

  1. L. Zhang, C.W. He, Y.H. Guo, J.G. Han, Y.W. Zhang, X.Y. Wang, Development of SnAg-based lead-free solders in electronics packaging[J]. Microelectron. Reliab. 52(3), 559–578 (2012)

    Article  CAS  Google Scholar 

  2. H.F. Zou, H.J. Yang, Z.F. Zhang, Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals[J]. Acta Mater. 56(11), 2649–2662 (2008)

    Article  CAS  Google Scholar 

  3. D.G. Kim, S.B. Jung, Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate[J]. J. Alloy. Compd. 386(1–2), 151 (2005)

    Article  CAS  Google Scholar 

  4. L. Zhang, S.B. Xue, L.L. Gao, Y. Chen, S.L. Yu, Z. Sheng, G. Zeng, Microstructure and creep properties of Sn–Ag–Cu lead-free solders bearing minor amounts of the rare earth cerium[J]. Solder. Surf. Mount Technol. 22(2), 30 (2010)

    Article  CAS  Google Scholar 

  5. J. Li, J. Karooinen, T. Laurila, K. Kivilahti, Reliability of lead-free solder interconnections in thermal and power cycling tests[J]. IEEE Trans. Compon. Packaging 32(2), 302 (2009)

    Article  Google Scholar 

  6. S.K. Kang, D.Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.I. Cho, J. Yu, W.K. Choi, Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying[J]. J. Miner., Met. Mater. Soc. 56(6), 34–38 (2004)

    Article  CAS  Google Scholar 

  7. Z.J. Han, S.B. Xue, J.X. Wang, X. Zhang, L. Zhang, S.L. Yu, H. Wang, Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology[J]. Trans. Nonferrous Met. Soc. China 18(4), 814 (2008)

    Article  CAS  Google Scholar 

  8. K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints[J]. J. Alloy. Compd. 352(1–2), 226 (2003)

    Article  CAS  Google Scholar 

  9. W.X. Dong, Y.W. Shi, Y.P. Lei, Z.D. Xia, F. Guo, Study of solidification cracks in Sn–Ag–Cu lead-free solder[J]. J. Electron. Mater. 38(9), 1906 (2009)

    Article  CAS  Google Scholar 

  10. L. Zhang, S.B. Xue, Y. Chen, Z.J. Han, J.X. Wang, S.L. Yu, F.Y. Lu, Effects of cerium on Sn–Ag–Cu alloys on finite element simulation and experiments[J]. J. Rare Earths 27(1), 138–144 (2009)

    Article  Google Scholar 

  11. X. Ma, F.J. Wang, Y.Y. Qian, F. Yoshida, Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface[J]. Mater. Lett. 57(22–23), 3361–3365 (2003)

    Article  CAS  Google Scholar 

  12. N. Mookam, K. Kanlayasiri, Evolution of intermetallic compounds between Sn-0.3Ag-0.7Cu low-silver lead-free and Cu substrate during thermal aging[J]. J. Mater. Sci. Technol. 28(1), 53–59 (2012)

    Article  CAS  Google Scholar 

  13. M.J. Rizvi, C. Bailey, Y.C. Chan, M.N. Islam, H. Lu, Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder part II. Growth of intermetallic layer with Cu during wetting and aging[J]. J. Alloy. Compd. 438(1–2), 122–128 (2007)

    Article  CAS  Google Scholar 

  14. H.R. Kotadia, O. Mokhtari, M.P. Clode, M.A. Green, S.H. Mannan, Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates[J]. J. Alloy. Compd. 511(1), 176–188 (2012)

    Article  CAS  Google Scholar 

  15. M.J. Rizvi, Y.C. Chan, C. Bailey, H. Lu, M.N. Islm, Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging[J]. J. Alloy. Compd. 407(1–2), 208–214 (2006)

    Article  CAS  Google Scholar 

  16. Y.C. Chan, A.C.K. So, J.K.L. Lai, Growth kinetic studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints[J]. Mater. Sci. Eng., B 55(1–2), 5–13 (1998)

    Article  Google Scholar 

  17. C.W. Hwang, K.S. Kim, K. Suganuma, Interfaces in lead-free soldering[J]. J. Electron. Mater. 32(11), 1249–1256 (2003)

    Article  CAS  Google Scholar 

  18. H.Q. Wang, F. Gao, X. Ma, Y.Y. Qian, Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance[J]. Scripta Mater. 55(9), 823–826 (2006)

    Article  CAS  Google Scholar 

  19. L. Zhang, S.B. Xue, L.L. Gao, W. Dai, F. Ji, Y. Chen, S.L. Yu, Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging[J]. Microelectron. Eng. 88(9), 2848–2851 (2011)

    Article  CAS  Google Scholar 

  20. W.Q. Peng, E. Monlevade, M.E. Marques, Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu[J]. Microelectron. Reliab. 47(12), 2161–2168 (2007)

    Article  CAS  Google Scholar 

  21. L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, H. Ye, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging[J]. J. Alloy. Compd. 510(1), 38–45 (2012)

    Article  CAS  Google Scholar 

  22. F.J. Wang, F. Gao, X. Ma, Y.Y. Qian, Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging[J]. J. Electron. Mater. 35(10), 1818–1824 (2006)

    Article  CAS  Google Scholar 

  23. R. Mayappan, Z.A. Ahmad, Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder[J]. Intermetallics 18(4), 730–735 (2010)

    Article  CAS  Google Scholar 

  24. H.T. Lee, M.H. Chen, Influence of intermetallic compounds on the adhesive strength of solder joints[J]. Mater. Sci. Eng., A 33(1–2), 24–34 (2002)

    Google Scholar 

  25. J.W. Yoon, Y.H. Lee, D.G. Kim, H.B. Kang, S.J. Suh, C.W. Yang, C.B. Lee, J.M. Jung, C.S. Yoo, S.B. Jung, Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate[J]. J. Alloy. Compd. 381(1–2), 151–157 (2004)

    Article  CAS  Google Scholar 

  26. J.W. Yoon, B.I. Noh, B.K. Kim, C.C. Shur, S.B. Jung, Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints[J]. J. Alloy. Compd. 486(1–2), 142–147 (2009)

    Article  CAS  Google Scholar 

  27. D.Q. Yu, C.M.L. Wu, C.M.T. Law, L. Wang, J.K.L. Lai, Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method[J]. J. Alloy. Compd. 392(1–2), 192–199 (2005)

    Article  CAS  Google Scholar 

  28. T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, J.K. Kivilahti, Morphology, kinetics, and the thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu[J]. J. Mater. Res. 17(2), 291–301 (2002)

    Article  CAS  Google Scholar 

  29. J.W. Yoon, B.I. Noh, Y.H. Lee, H.S. Lee, S.B. Jung, Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint[J]. Microelectron. Reliab. 48(11-12), 1864–1874 (2008)

    Article  CAS  Google Scholar 

  30. J. Zhao, C.Q. Cheng, L. Qi, C.Y. Chi, Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples[J]. J. Alloy. Compd. 473(1–2), 382–388 (2009)

    Article  CAS  Google Scholar 

  31. A.K. Gain, T. Fouzder, Y.C. Chan, W.K.C. Yung, Microstructure, kinetic analysis and hardness of Sn–Ag–Cu wt% nano-ZrO2 composite solder on OSP-Cu pads[J]. J. Alloy. Compd. 509(7), 3319–3325 (2011)

    Article  CAS  Google Scholar 

  32. A. Sharif, Y.C. Chan, Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow[J]. Mater. Sci. Eng., B 106(2), 126–131 (2004)

    Article  Google Scholar 

  33. C.M. Chuang, K.L. Lin, Effect of microelements addition on the interfacial reaction between Sn–Ag–Cu solders and the Cu substrate[J]. J. Electron. Mater. 32(12), 1426–1431 (2003)

    Article  CAS  Google Scholar 

  34. X.Y. Li, F.H. Li, F. Guo, Y.W. Shi, Effect of isothermal aging and thermal cycling on the interfacial IMC growth and fracture behavior of SnAgCu/Cu joints[J]. J. Electron. Mater. 40(1), 51–61 (2011)

    Article  Google Scholar 

  35. B.L. Chen, G.Y. Li, An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints[J]. IEEE Trans. Compon. Packag. Technol. 28(3), 534–541 (2005)

    Article  CAS  Google Scholar 

  36. L.C. Tsao, T.T. Lo, S.F. Peng, Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nano TiO2 alloys and Cu substrate[C] 11th international conference on electronic packaging and high density packaging, (2010)

Download references

Acknowledgments

The present work was carried out with the supported by the Natural Science Foundation of Jiangsu Province (BK2012144); the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province(12KJB460005); the Jiangsu Normal University Foundation (11XLR16) and the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation (JSAWS-11-03).

Author information

Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Xi-ying Fan, Cheng-wen He & Yong-huan Guo

  2. Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Liang Zhang

Authors
  1. Liang Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xi-ying Fan
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Cheng-wen He
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yong-huan Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Liang Zhang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhang, L., Fan, Xy., He, Cw. et al. Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging. J Mater Sci: Mater Electron 24, 3249–3254 (2013). https://doi.org/10.1007/s10854-013-1236-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-013-1236-9

Keywords

Search

Navigation