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Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

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Abstract

Ag nano-particle reinforced Sn30Bi0.5Cu-xAg (x = 1 wt%, 2 wt% and 5 wt%) solder pastes were prepared and reflowed on Cu substrates at 523 K. Then, the solder joints were liquid aged at 473 K for 6 and 12 h. Microstructural evolutions of these solder joints were observed by scanning electron microscopy (SEM). The results show that Bi-rich phase was refined in the as-reflowed Sn30Bi0.5Cu-xAg composite solder matrices. With the increase of the liquid aging time, Bi-rich phase was refined both in the Sn30Bi0.5Cu solder and in the Sn30Bi0.5Cu-xAg composite solders. The addition of Ag nano-particles changed the growth rate of the IMC layers during liquid aging due to the absorption effect of the Ag3Sn micro-particles.

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Acknowledgments

This research was financial supported by a Key Scientific and Technological Project of Chongqing (Project No. CSTC, 2009AC4046), a Natural Science Foundation Project of CQ CSTC (Project No. CSTC, 2010BB4039), a Fundamental Research Funds for the Central Universities of P R China (Project No. CDJZR10130010) and a Fundamental Research Funds for the Central Universities (Project No. CDJXS10131155).

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  1. College of Material Science and Engineering, Chongqing University, Chongqing, 400044, China

    Jun Shen, Changfei Peng, Mali Zhao & Cuiping Wu

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  1. Jun Shen
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  2. Changfei Peng
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  3. Mali Zhao
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  4. Cuiping Wu
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Correspondence to Jun Shen.

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Shen, J., Peng, C., Zhao, M. et al. Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging. J Mater Sci: Mater Electron 23, 1409–1414 (2012). https://doi.org/10.1007/s10854-011-0606-4

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  • DOI: https://doi.org/10.1007/s10854-011-0606-4

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