Study on thermal stability of electroless deposited Ni-Co-P alloy thin film
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The Ni–P and Ni-Co-P alloy thin films were deposited on silicon substrates with electroless technique. The solid state metallurgical reactions were investigated with silicon for the viewpoint of Co co-deposition effect. The alloy film kept amorphous state with increasing Co content even though the P content decreased. The films become more amorphous, and the thermal stability increased with increment of Co content in the deposit. The Co content was varied from 11.013 to 45.068 wt% while P content was decreased from 9.340 to 6.491 wt% by varying the concentration of components in electroless deposition baths. The thermal stability was examined by X-ray diffractometer (XRD), four probe, and atomic force microscopy (AFM). The results indicated the Ni-Co-P alloy films with lower P content show the higher thermal stability then the ordinary Ni–P films and prevent the silicidation at low temperature because the Ni crystallization formation suppressed by the co-deposition of Co.
KeywordsAmorphous Alloy Sheet Resistance PdCl2 Electroless Plating Alloy Film
This work was suported by the Department of Science and Technology, Ministry of Science, India, under the project number SR/S3/EECE/043/2007.
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