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Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

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Abstract

In this study, the effect of various seed layers (95Ni–5Cr, 80Ni–20Cr and Cr) on the adhesion strength of flexible copper clad laminate (FCCL), which was manufactured by the roll-to-roll process, was evaluated after heat treatment. The changes in the morphology, chemical bonding, and adhesion properties were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS), and a 90° peel test. The results showed that both the peel strength and thermal resistance of the FCCL increased as the Cr ratio of the seed layer increased. The roughness of the fracture surface decreased as the heat treatment temperature and holding time increased. The heat treatment of the FCCL increased the proportion of C–N bonds and reduced that of the C–O and carbonyl (C=O) bonds in the polyimide. The chemical function and roughness of the fracture surface were affected by the composition and ratio of the seed layer. Therefore, the adhesion strength between the metal and polyimide was mostly attributed to the chemical interaction between the metal layer and the functional groups of the polyimide.

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Acknowledgments

The present work was carried out with the support of a Next Generation New Technology Development Program (Project No. 10030049) of the Korea Ministry of Commerce, Industry and Energy (MOCIE).

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Authors and Affiliations

  1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do, 440-746, Republic of Korea

    Bo-In Noh, Jeong-Won Yoon & Seung-Boo Jung

  2. School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae gil, Hwajeon-dong, Deogyang-gu, Goyang, Gyeonggi-do, 412-791, Republic of Korea

    Bo-Young Lee

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  1. Bo-In Noh
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  2. Jeong-Won Yoon
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Correspondence to Bo-In Noh.

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Noh, BI., Yoon, JW., Lee, BY. et al. Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits. J Mater Sci: Mater Electron 22, 790–796 (2011). https://doi.org/10.1007/s10854-010-0213-9

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  • DOI: https://doi.org/10.1007/s10854-010-0213-9

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