Reactive nanolayers for physiologically compatible microsystem packaging

  • Xiaotun Qiu
  • David Welch
  • Jennifer Blain Christen
  • Jie Zhu
  • Jon Oiler
  • Cunjiang Yu
  • Ziyu Wang
  • Hongyu Yu


This paper described a novel physiologically compatible wafer bonding technique for bio-microelectromechanical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al nanofilms as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive nanofilm bonding technique for broad applications in packaging bio-MEMS and microfluidic systems.


Silicon Wafer Bonding Process Localize Heating Bilayer Thickness Local Heat Source 


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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  • Xiaotun Qiu
    • 1
  • David Welch
    • 1
  • Jennifer Blain Christen
    • 1
  • Jie Zhu
    • 1
  • Jon Oiler
    • 2
  • Cunjiang Yu
    • 3
  • Ziyu Wang
    • 2
  • Hongyu Yu
    • 1
    • 2
  1. 1.Department of Electrical EngineeringArizona State UniversityTempeUSA
  2. 2.School of Earth and Space ExplorationArizona State UniversityTempeUSA
  3. 3.Department of Mechanical and Aerospace EngineeringArizona State UniversityTempeUSA

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