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Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder

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Abstract

Effects of Pr addition on wettability, microstructure of Sn3.8Ag0.7Cu solder were studied, the mechanical properties of solder joints were investigated and the fracture morphologies were also analyzed in this paper. The results indicate that adding appropriate amount of Pr can evidently improve the wettability of solder, and it is also found that Pr can refine the β-Sn dendrites and reduce the intermetallic compounds growth inside the solder due to the fine PrSn3 particles formed in the solder which can act as heterogeneous nucleation sites. Moreover, the joints soldered with the SnAgCuPr solders possess sound mechanical properties which may result from the finer microstructure improved by the Pr.

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Acknowledgments

The present work was carried out with the support of the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan (Project No. CX09B_074z); support of Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing foundation (Project No. BCXJ09-07).

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  1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People’s Republic of China

    Lili Gao, Songbai Xue, Liang Zhang, Zhengxiang Xiao, Wei Dai, Feng Ji, Huan Ye & Guang Zeng

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  1. Lili Gao
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  2. Songbai Xue
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  8. Guang Zeng
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Correspondence to Songbai Xue.

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Gao, L., Xue, S., Zhang, L. et al. Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder. J Mater Sci: Mater Electron 21, 910–916 (2010). https://doi.org/10.1007/s10854-009-0017-y

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